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PADC3224IRGZT

Texas Instruments

PADC3224IRGZT by Texas Instruments

The Texas Instruments PADC3224IRGZT is a 12-bit ADC with 2 analog in channels, operating from -40 to 85°C. With a sample rate of 125 MHz, it offers a max analog input voltage of ±2V and outputs data in serial format. Ideal for industrial applications requiring high-speed and precise analog-to-digital conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,257 parts In-Stock

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9,257

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Digiode

USA . 109 parts In-Stock

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109

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Distributors (Availability)

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One Stop Electronics

USA . 346 parts In-Stock

1+ parts

$4.000

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346

$4.000

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AZTECH Wire

Italy . 642 parts In-Stock

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$5.144

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642

$5.144

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Parana Technologies

USA . 285 parts In-Stock

1+ parts

$7.578

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$8.088

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285

$7.578

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$8.088

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DigiPath Technology Company

USA . 1,513 parts In-Stock

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$8.345

100+ parts

$7.677

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1,513

$8.345

$7.677

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ChromeModa Solutions

Germany . 4,328 parts In-Stock

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$8.515

100+ parts

$6.982

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4,328

$8.515

$6.982

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IDEA Electronic Components Group

UK . 1,898 parts In-Stock

1+ parts

$8.515

100+ parts

$8.089

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$7.664

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1,898

$8.515

$8.089

$7.664

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Corphita

USA . 3,996 parts In-Stock

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Microchip USA

USA . 417 parts In-Stock

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Overview

Discover the unparalleled quality and precision of the PADC3224IRGZT Analog-to-Digital Converter by Texas Instruments. With a reputation for excellence in electronic components, TI delivers reliability and innovation in every product. This ADC is ideal for a wide range of applications, from industrial automation to medical devices. Experience the value and benefits of this versatile chip carrier with a very thin profile, offering high performance and accuracy to meet your specific needs. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the internal components, ensuring long-term reliability.

No. of Analog In Channels: 2

Having 2 analog input channels allows for versatile input options and flexibility in designing circuits.

Surface Mount: YES

Surface mount capability makes for easy integration into circuit boards, reducing installation time and complexity.

No. of Bits: 12

With a high resolution of 12 bits, this ADC can provide accurate and detailed digital representation of analog signals.

No. of Terminals: 48

The high number of terminals allows for efficient connectivity with other components in the circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design optimizes thermal management and space-saving in the circuit.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and functionality in a wide range of environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in harsh cold conditions without risk of damage.

Terminal Position: QUAD

The quad terminal position facilitates easy connections and soldering, enhancing the overall ease of use.

Maximum Seated Height: 1 mm

The low seated height makes this ADC suitable for compact and space-constrained applications.

Width: 7 mm

The compact width size allows for easy integration into various circuit layouts.

Length: 7 mm

The compact length size ensures that this ADC can fit into small spaces without compromising on functionality.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this ADC can withstand harsh environmental conditions typically found in industrial settings.

Maximum Analog Input Voltage: 2 V

With a maximum analog input voltage of 2V, this ADC can accurately convert a wide range of analog signals.

Sample Rate: 125 MHz

The high sample rate of 125 MHz ensures rapid and accurate conversion of analog signals into digital data.

Terminal Form: NO LEAD

The no lead terminal form simplifies the installation process and reduces the risk of soldering errors.

Converter Type: ADC, PROPRIETARY METHOD

The use of a proprietary method in the ADC conversion process ensures reliable and accurate data conversion.

Nominal Supply Voltage: 1.8 V

With a nominal supply voltage of 1.8V, this ADC is energy-efficient and suitable for low-power applications.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

The multiple output bit codes provide flexibility in data representation and compatibility with various systems.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and compact circuit design.

Minimum Analog Input Voltage: -2 V

With a minimum analog input voltage of -2V, this ADC can accurately convert both positive and negative voltage signals.

Output Format: SERIAL

The serial output format enables easy integration with digital systems and data processing equipment.

Technical Specifications

Analog-to-Digital Converters PADC3224IRGZT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

125 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Trade Compliance

PADC3224IRGZT Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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