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PADC3444IRTQT

Texas Instruments

PADC3444IRTQT by Texas Instruments

PADC3444IRTQT by Texas Instruments is a 14-bit ADC with 4 analog input channels, operating at a sample rate of 125 MHz. It features a max analog input voltage of 2V and min of -2V, suitable for industrial applications requiring high-speed data conversion. This surface-mount chip carrier package has a compact size of 8x8mm and operates in temperatures ranging from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,439 parts In-Stock

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Digiode

USA . 1,900 parts In-Stock

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1,900

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Nova Conductors

Japan . 50 parts In-Stock

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50

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One Stop Electronics

USA . 749 parts In-Stock

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$4.000

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749

$4.000

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Ampacity Inc.

Singapore . 1,149 parts In-Stock

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$12.000

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$12.000

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AZTECH Wire

Italy . 473 parts In-Stock

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$15.939

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$15.939

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Parana Technologies

USA . 1,869 parts In-Stock

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$19.057

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$19.109

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$19.057

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$19.109

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DigiPath Technology Company

USA . 1,341 parts In-Stock

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$20.984

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$19.305

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IDEA Electronic Components Group

UK . 1,770 parts In-Stock

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$21.412

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$20.341

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$19.271

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$21.412

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$19.271

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ChromeModa Solutions

Germany . 1,228 parts In-Stock

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$21.412

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$17.558

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Continental Prestige Electronics

USA . 4,695 parts In-Stock

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Corphita

USA . 3,638 parts In-Stock

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Argo Parts USA

USA . 2,349 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Microchip USA

USA . 156 parts In-Stock

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Overview

Discover unparalleled precision and performance with the PADC3444IRTQT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Analog-to-Digital Converters that excel in accuracy and reliability. Ideal for a wide range of applications, this innovative product offers customers unmatched value and benefits. Experience seamless integration and exceptional results with the PADC3444IRTQT, setting new standards in quality and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various industrial applications.

No. of Analog In Channels: 4

With 4 analog input channels, this product offers flexibility and versatility in signal processing and conversion.

Surface Mount: YES

The surface mount capability allows for easy integration into compact electronic designs, saving space and reducing assembly time.

Package Shape: SQUARE

The square package shape provides a standardized form factor for easier handling and mounting on circuit boards.

No. of Bits: 14

With 14 bits of resolution, this ADC offers high precision and accurate conversion of analog signals into digital data.

No. of Terminals: 56

The large number of terminals allows for efficient connectivity and signal routing within the system.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination offers excellent thermal management and electrical performance in a compact form factor.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in various industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range makes this product suitable for use in extreme cold conditions.

Terminal Position: QUAD

The quad terminal position simplifies the connection and installation of the ADC in a circuit.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a compact design and easy integration into tight spaces.

Width: 8 mm

The narrow width of the product enables efficient layout and placement on a circuit board.

Length: 8 mm

The short length of the product makes it ideal for applications where space is limited.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions.

Maximum Analog Input Voltage: 2 V

The high maximum analog input voltage range allows for the processing of a wide variety of signals.

Sample Rate: 125 MHz

With a high sample rate of 125 MHz, this ADC can handle fast-changing analog signals with accuracy.

Terminal Form: NO LEAD

The no lead terminal form simplifies the assembly process and reduces the risk of solder joint failures.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary ADC conversion method offers unique features and better performance compared to standard conversion techniques.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage requirement helps to reduce power consumption and heat dissipation in the system.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

The output bit code options provide flexibility in data representation for different applications.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and efficient use of board space.

Minimum Analog Input Voltage: -2 V

The low minimum analog input voltage range enables the processing of a wide range of signal amplitudes.

Output Format: SERIAL

The serial output format simplifies data transmission and integration with digital systems.

Technical Specifications

Analog-to-Digital Converters PADC3444IRTQT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

125 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

56

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.315 in (8 mm)

Length:

0.315 in (8 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N56

Trade Compliance

PADC3444IRTQT Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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