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PADC32RF54RTD

Texas Instruments

PADC32RF54RTD by Texas Instruments

PADC32RF54RTD by Texas Instruments is a 14-bit ADC with 2 analog in channels, 0.024414% max linearity error, and 3000 MHz sample rate. Ideal for applications requiring high-speed data conversion such as telecommunications equipment or industrial automation systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,450 parts In-Stock

1+ parts

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7,450

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Digiode

USA . 1,057 parts In-Stock

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1,057

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 367 parts In-Stock

1+ parts

$10.223

100+ parts

$949.318

1k+ parts

$9.200

10k+ parts

-

367

$10.223

$949.318

$9.200

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DigiPath Technology Company

USA . 446 parts In-Stock

1+ parts

$11.256

100+ parts

-

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446

$11.256

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ChromeModa Solutions

Germany . 2,251 parts In-Stock

1+ parts

$11.486

100+ parts

$9.419

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2,251

$11.486

$9.419

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IDEA Electronic Components Group

UK . 1,217 parts In-Stock

1+ parts

$11.486

100+ parts

$10.912

1k+ parts

$10.337

10k+ parts

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1,217

$11.486

$10.912

$10.337

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Semicontronic

India . 1,017 parts In-Stock

1+ parts

$16.000

100+ parts

$15.600

1k+ parts

$15.520

10k+ parts

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1,017

$16.000

$15.600

$15.520

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AZTECH Wire

Italy . 330 parts In-Stock

1+ parts

$17.731

100+ parts

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330

$17.731

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One Stop Electronics

USA . 672 parts In-Stock

1+ parts

$36.000

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672

$36.000

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Ampacity Inc.

Singapore . 1,104 parts In-Stock

1+ parts

$38.000

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1,104

$38.000

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Corphita

USA . 1,551 parts In-Stock

1+ parts

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1,551

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Corohmni

South Africa . 400 parts In-Stock

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400

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Overview

Texas Instruments, a trusted leader in semiconductor manufacturing, presents the PADC32RF54RTD Analog-to-Digital Converter - a game-changer in precision measurement applications. With its cutting-edge technology and unmatched quality, this product offers customers unparalleled accuracy and reliability. Whether used in industrial automation, medical devices, or telecommunications, the PADC32RF54RTD provides exceptional value by delivering precise results and ensuring optimal performance. Upgrade your systems with Texas Instruments and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the analog-to-digital converter.

No. of Analog In Channels: 2

The two analog input channels allow for multiple input signals to be converted simultaneously, increasing efficiency.

Surface Mount: YES

The surface mount capability makes installation and integration into circuit boards easier and more efficient.

No. of Bits: 14

The 14-bit resolution provides a high level of accuracy and precision in converting analog signals to digital.

Maximum Linearity Error (EL): 0.024414%

The low linearity error ensures that the digital output closely resembles the original analog input signal.

No. of Terminals: 76

The numerous terminals allow for versatile connectivity options and integration into a variety of electronic systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of package styles provides efficient heat dissipation and space-saving design for the analog-to-digital converter.

Maximum Operating Temperature: 85 °C

The high operating temperature range allows for reliable performance in a variety of environmental conditions.

Minimum Operating Temperature: -40 °C

The low operating temperature indicates that the converter can withstand and function in colder environments.

Terminal Position: QUAD

The quad terminal position provides stable and secure connections for the analog input and output signals.

Maximum Seated Height: 0.975 mm

The low seated height allows for compact installation and integration into space-constrained electronic devices.

Width: 9 mm

The 9mm width ensures compatibility with standard electronic components and circuit board layouts.

Length: 9 mm

The 9mm length also contributes to the compact and space-saving design of the analog-to-digital converter.

Maximum Analog Input Voltage: 1.1 V

The high maximum analog input voltage accommodates a wide range of input signals for conversion.

Sample Rate: 3000 MHz

The high sample rate allows for fast and accurate conversion of analog signals to digital data.

Terminal Form: NO LEAD

The no lead terminal form simplifies installation and reduces the risk of damage during integration.

Converter Type: ADC, PROPRIETARY METHOD

The use of a proprietary conversion method indicates a customized and optimized process for achieving high-quality digital outputs.

Nominal Supply Voltage: 1.2 V

The low nominal supply voltage helps in reducing power consumption and heat generation during operation.

Output Bit Code: 2S COMPLEMENT, OFFSET BINARY

The output bit code format ensures compatibility with various digital systems and processing methods.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for precise and secure connections with other electronic components and devices.

Minimum Analog Input Voltage: -1.1 V

The high and low analog input voltage range allows for the conversion of both positive and negative signals with ease.

Output Format: SERIAL

The serial output format enables easy interfacing with other digital systems and devices for data transmission and processing.

Technical Specifications

Analog-to-Digital Converters PADC32RF54RTD attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

2’s Complement, Offset Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.024414 %

Sample Rate:

3000 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-1.1 V

Maximum Analog Input Voltage:

1.1 V

Nominal Supply Voltage:

1.2 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

76

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.038 in (0.975 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC76,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N76

Trade Compliance

PADC32RF54RTD Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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