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ADS8344NBG4

Texas Instruments

ADS8344NBG4 by Texas Instruments

The Texas Instruments ADS8344NBG4 is a 16-bit ADC with 8 analog input channels, 0.0092% linearity error, and 0.1 MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 16,300 parts In-Stock

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Vyrian

USA . 7,357 parts In-Stock

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7,357

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VNN

France . 2,378 parts In-Stock

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2,378

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Digiode

USA . 1,359 parts In-Stock

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1,359

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Nova Conductors

Japan . 1,000 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,198 parts In-Stock

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$1.382

100+ parts

-

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$1.327

10k+ parts

$1.327

4,198

$1.382

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$1.327

$1.327

Ampacity Inc.

Singapore . 1,219 parts In-Stock

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$2.000

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1,219

$2.000

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One Stop Electronics

USA . 1,577 parts In-Stock

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$9.000

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1,577

$9.000

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Semicontronic

India . 884 parts In-Stock

1+ parts

$14.000

100+ parts

$13.650

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$13.580

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884

$14.000

$13.650

$13.580

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AZTECH Wire

Italy . 442 parts In-Stock

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$15.546

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442

$15.546

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Corohmni

South Africa . 54 parts In-Stock

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$16.922

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54

$16.922

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Parana Technologies

USA . 883 parts In-Stock

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$24.390

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$25.066

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883

$24.390

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$25.066

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ChromeModa Solutions

Germany . 4,637 parts In-Stock

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$27.405

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$22.472

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$27.405

$22.472

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IDEA Electronic Components Group

UK . 526 parts In-Stock

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$27.405

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$26.035

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$24.664

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526

$27.405

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$24.664

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QUARKTWIN TECHNOLOGY LTD

USA . 21,551 parts In-Stock

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Microchip USA

USA . 4,250 parts In-Stock

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Corphita

USA . 2,659 parts In-Stock

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Continental Prestige Electronics

USA . 1,404 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Lixinc

USA . 975 parts In-Stock

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DigiPath Technology Company

USA . 946 parts In-Stock

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$24.708

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Argo Parts USA

USA . 706 parts In-Stock

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706

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Advanced Electronics

New Zealand . 323 parts In-Stock

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323

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Bastille Electronics

Australia . 120 parts In-Stock

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Modulus Dynamics

Lithuania . 39 parts In-Stock

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Overview

Experience the precision and reliability of Texas Instruments with the ADS8344NBG4 Analog-to-Digital Converter. This small outline, shrink pitch converter is perfect for industrial applications, offering a high sample rate of 0.1 MHz and low linearity error of just 0.0092%. With a dual terminal position and nickel palladium gold finish, this converter ensures accurate and efficient data conversion. Trust in Texas Instruments to deliver top-quality products that exceed expectations, providing unmatched value and performance for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight, durable, and cost-effective.

No. of Analog In Channels: 8

Having 8 analog input channels allows for the conversion of multiple analog signals simultaneously, increasing efficiency and throughput.

Surface Mount: YES

Surface mount capability means easy integration onto circuit boards, saving space and simplifying assembly.

No. of Bits: 16

With a 16-bit resolution, this ADC provides high precision and accuracy in converting analog signals to digital.

Maximum Linearity Error (EL): 0.0092%

The low linearity error ensures that the converted digital values closely match the actual analog inputs, resulting in precise data acquisition.

Power Supplies (V): 2.7/5

The dual power supply options of 2.7V and 5V provide flexibility in operation and compatibility with different voltage systems.

No. of Terminals: 20

Having 20 terminals allows for easy connectivity and interfacing with other components in the system.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space on the PCB and enhances thermal efficiency during operation.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage requirement of 2.7V enables efficient operation even in low-power scenarios.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the ADC can perform reliably in industrial environments without overheating.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40°C to 85°C ensures the ADC's performance in both extreme cold and hot conditions.

Technical Specifications

Analog-to-Digital Converters ADS8344NBG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0092 %

Sample Rate:

100 kHz

Hold Mode:

Sample

Maximum Conversion Time:

6.67 µs

Electrical Specifications

Power Supplies:

2.7/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.283 in (7.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP20,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8344NBG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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