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PADC3541IRSBT

Texas Instruments

PADC3541IRSBT by Texas Instruments

PADC3541IRSBT by Texas Instruments is a 14-bit ADC with 0.012817% linearity error, 10 MHz sample rate, and 2.25V max analog input voltage. Ideal for industrial applications requiring high precision data conversion in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,806 parts In-Stock

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8,806

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Digiode

USA . 4,845 parts In-Stock

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4,845

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Distributors (Availability)

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AZTECH Wire

Italy . 499 parts In-Stock

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$5.438

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499

$5.438

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One Stop Electronics

USA . 979 parts In-Stock

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$8.000

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979

$8.000

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Semicontronic

India . 1,336 parts In-Stock

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$9.000

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$8.775

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$8.730

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$9.000

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$8.730

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Parana Technologies

USA . 19 parts In-Stock

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$13.930

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$14.410

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19

$13.930

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$14.410

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IDEA Electronic Components Group

UK . 2,089 parts In-Stock

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$15.652

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$14.869

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$14.087

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2,089

$15.652

$14.869

$14.087

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ChromeModa Solutions

Germany . 1,045 parts In-Stock

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$15.652

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$12.835

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$15.652

$12.835

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Corohmni

South Africa . 327 parts In-Stock

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$16.331

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327

$16.331

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Ampacity Inc.

Singapore . 877 parts In-Stock

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$31.000

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$31.000

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Continental Prestige Electronics

USA . 4,903 parts In-Stock

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Corphita

USA . 4,041 parts In-Stock

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DigiPath Technology Company

USA . 1,354 parts In-Stock

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$14.112

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$14.112

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Argo Parts USA

USA . 711 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Unlock the power of precise analog-to-digital conversion with the PADC3541IRSBT by Texas Instruments. Manufactured with top-quality materials, this ADC boasts impressive linearity and a wide operating temperature range. Perfect for industrial applications, this chip carrier device offers 14 bits of resolution and a fast 10 MHz sample rate. Experience the unmatched value and reliability that Texas Instruments is known for, while enjoying the benefits of accurate data acquisition in a compact and versatile package. Elevate your projects with the PADC3541IRSBT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness.

Surface Mount: YES

Ease of installation and space-saving design.

No. of Bits: 14

High resolution for accurate analog-to-digital conversion.

Maximum Linearity Error (EL): 0.012817%

High accuracy in converting analog signals to digital.

No. of Terminals: 40

Sufficient connectivity options for various applications.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with high temperatures.

Minimum Operating Temperature: -40 °C

Operational in extreme cold conditions as well.

Maximum Analog Input Voltage: 2.25 V

Capable of handling higher analog input voltages.

Sample Rate: 10 MHz

Fast conversion rate for real-time data processing.

Technical Specifications

Analog-to-Digital Converters PADC3541IRSBT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial, Parallel, Word

Maximum Linearity Error (EL):

0.012817 %

Sample Rate:

10 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2.25 V

Maximum Analog Input Voltage:

2.25 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.016 in (0.4 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC40,.20SQ,16

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

Trade Compliance

PADC3541IRSBT Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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