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PADC3244IRGZT

Texas Instruments

PADC3244IRGZT by Texas Instruments

PADC3244IRGZT by Texas Instruments is a 14-bit ADC with 2 analog in channels, operating from -40 to 85°C. It has a sample rate of 125 MHz and supports industrial applications requiring high-speed data conversion. The package style is chip carrier with a very thin profile, making it suitable for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,389 parts In-Stock

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6,389

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Digiode

USA . 3,837 parts In-Stock

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3,837

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Distributors (Availability)

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AZTECH Wire

Italy . 193 parts In-Stock

1+ parts

$10.971

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193

$10.971

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Parana Technologies

USA . 1,693 parts In-Stock

1+ parts

$18.167

100+ parts

$1,687.052

1k+ parts

$16.350

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1,693

$18.167

$1,687.052

$16.350

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DigiPath Technology Company

USA . 2,107 parts In-Stock

1+ parts

$20.004

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2,107

$20.004

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ChromeModa Solutions

Germany . 1,494 parts In-Stock

1+ parts

$20.412

100+ parts

$16.738

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1,494

$20.412

$16.738

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IDEA Electronic Components Group

UK . 68 parts In-Stock

1+ parts

$20.412

100+ parts

$19.391

1k+ parts

$18.371

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68

$20.412

$19.391

$18.371

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One Stop Electronics

USA . 434 parts In-Stock

1+ parts

$34.000

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434

$34.000

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Component Stockers USA

USA . 267 parts In-Stock

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$99.990

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267

$99.990

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Corphita

USA . 4,380 parts In-Stock

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4,380

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Microchip USA

USA . 282 parts In-Stock

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282

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Overview

Unlock the power of precise data conversion with the PADC3244IRGZT by Texas Instruments. As a trusted leader in analog-to-digital converters, Texas Instruments delivers unmatched quality and reliability in every product. Ideal for a wide range of applications, this converter offers customers unparalleled value and performance. Experience seamless integration, high-speed sampling rates, and exceptional accuracy with the PADC3244IRGZT. Elevate your projects with Texas Instruments and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for a wide range of applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for versatile input options and flexibility in data acquisition.

Surface Mount: YES

Being surface mountable makes installation and assembly of the product easier and more efficient.

No. of Bits: 14

With 14 bits of resolution, this product offers high accuracy in converting analog signals to digital data.

No. of Terminals: 48

The large number of terminals allows for connectivity to various external devices and components.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can perform reliably in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures the product can be used in both hot and cold environments.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product is rugged and durable for use in demanding settings.

Maximum Analog Input Voltage: 2 V

With a high maximum input voltage, this product can handle a wide range of signal levels.

Sample Rate: 125 MHz

The fast sampling rate allows for real-time conversion of analog signals, making it suitable for high-speed applications.

Technical Specifications

Analog-to-Digital Converters PADC3244IRGZT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

125 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Trade Compliance

PADC3244IRGZT Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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