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TLC2543CDWRG4

Texas Instruments

TLC2543CDWRG4 by Texas Instruments

TLC2543CDWRG4 by Texas Instruments is a 12-bit ADC with 11 analog in channels, 0.0244% EL, and 5V power supply. It is used for data acquisition systems, industrial automation, and sensor interfaces due to its small outline package style and CMOS technology.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 19,500 parts In-Stock

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Vyrian

USA . 6,260 parts In-Stock

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Digiode

USA . 1,913 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$13.500

100+ parts

$12.825

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$12.825

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5,000

$13.500

$12.825

$12.825

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Semicontronic

India . 527 parts In-Stock

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$14.000

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$13.650

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$13.580

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527

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Parana Technologies

USA . 705 parts In-Stock

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$17.036

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$17.260

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705

$17.036

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AZTECH Wire

Italy . 615 parts In-Stock

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$17.965

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Corohmni

South Africa . 85 parts In-Stock

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$18.577

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DigiPath Technology Company

USA . 331 parts In-Stock

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$18.759

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$17.258

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ChromeModa Solutions

Germany . 4,253 parts In-Stock

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$19.142

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$15.696

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IDEA Electronic Components Group

UK . 1,096 parts In-Stock

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$18.185

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$17.228

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Ampacity Inc.

Singapore . 813 parts In-Stock

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$26.000

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One Stop Electronics

USA . 338 parts In-Stock

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Continental Prestige Electronics

USA . 5,965 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 2,870 parts In-Stock

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Argo Parts USA

USA . 1,678 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Unlock the power of precision with the TLC2543CDWRG4 Analog-to-Digital Converter by Texas Instruments. Renowned for its high-quality manufacturing standards, Texas Instruments delivers an exceptional product that offers unparalleled accuracy and reliability. Ideal for a wide range of applications, this converter provides 12 bits of resolution across 11 analog input channels. With a fast conversion time of just 10 microseconds and a maximum linearity error of only 0.0244%, this compact device is perfect for demanding commercial projects. Experience the value and benefits of Texas Instruments' TLC2543CDWRG4 in your next design project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is common in electronics packaging, providing good insulation and protection for the internal components.

No. of Analog In Channels: 11

Having 11 analog input channels allows for versatile and extensive data conversion capabilities, suitable for a variety of applications.

Surface Mount: YES

Being surface mountable makes installation and integration of this ADC easier and more convenient in modern electronics designs.

No. of Bits: 12

With 12 bits of resolution, this ADC can provide accurate and detailed conversion of analog signals into digital data.

Maximum Conversion Time: 10 us

The quick conversion time of 10 microseconds ensures fast and efficient data processing, suitable for real-time applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing the overall performance of the ADC.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC method is known for its high accuracy and efficiency in converting analog signals to digital values, making this product a reliable choice.

Technical Specifications

Analog-to-Digital Converters TLC2543CDWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

66 kHz

Hold Mode:

Sample

Maximum Conversion Time:

10 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC2543CDWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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