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TLC2552IDGKG4

Texas Instruments

TLC2552IDGKG4 by Texas Instruments

TLC2552IDGKG4 by Texas Instruments is a 12-bit ADC with 0.0244% linearity error, 2 analog in channels, and 0.36 MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact package. Operates at -40 to 85 °C with 5V supply voltage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,277 parts In-Stock

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Vyrian

USA . 2,874 parts In-Stock

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2,874

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 452 parts In-Stock

1+ parts

$6.000

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452

$6.000

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AZTECH Wire

Italy . 623 parts In-Stock

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$13.827

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623

$13.827

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Parana Technologies

USA . 1,434 parts In-Stock

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$24.038

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$24.697

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1,434

$24.038

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$24.697

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DigiPath Technology Company

USA . 1,512 parts In-Stock

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$26.469

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$24.351

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1,512

$26.469

$24.351

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ChromeModa Solutions

Germany . 973 parts In-Stock

1+ parts

$27.009

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$22.147

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973

$27.009

$22.147

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IDEA Electronic Components Group

UK . 28 parts In-Stock

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$27.009

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$25.659

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$24.308

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28

$27.009

$25.659

$24.308

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One Stop Electronics

USA . 1,486 parts In-Stock

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$35.000

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$35.000

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Corphita

USA . 4,091 parts In-Stock

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Argo Parts USA

USA . 3,032 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Continental Prestige Electronics

USA . 485 parts In-Stock

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Overview

Experience high-quality analog-to-digital conversion with the TLC2552IDGKG4 by Texas Instruments. Designed with precision and reliability in mind, this ADC offers customers a seamless transition from analog to digital signals, making it perfect for industrial applications where accuracy is paramount. Enjoy the benefits of its compact package, fast conversion time, and wide operating temperature range, providing value and performance that exceed expectations. Upgrade your system with the TLC2552IDGKG4 and experience the difference Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside, ensuring a longer lifespan for the product.

No. of Analog In Channels: 2

Having 2 analog input channels allows for more flexibility in the types of signals that can be converted, making this product suitable for a variety of applications.

Surface Mount: YES

Surface mount capability makes installation and integration easier, especially in compact or crowded PCB designs.

No. of Bits: 12

With 12 bits of resolution, this ADC provides accurate and detailed conversion of analog signals into digital data.

Power Supplies (V): 5

Operating at a standard 5V power supply makes this ADC compatible with many existing systems and components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim design of the package saves space on the PCB and allows for dense integration of components.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance even in harsh environmental conditions.

Maximum Conversion Time: 2.77 us

Fast conversion time allows for real-time processing of analog signals, making this ADC suitable for high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and compatibility with various digital systems, enhancing the overall efficiency of the product.

Output Format: SERIAL

Serial output simplifies data transmission and communication with other digital devices, making it easier to integrate this ADC into a system.

Technical Specifications

Analog-to-Digital Converters TLC2552IDGKG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

360 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2.77 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP8,.19

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC2552IDGKG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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