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TLC2552IDGKR

Texas Instruments

TLC2552IDGKR by Texas Instruments

TLC2552IDGKR by Texas Instruments is a 12-bit ADC with 0.0244% EL, 2 analog in channels, and 0.36 MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact form factor. Operates at -40 to 85 °C with 5V supply voltage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,620 parts In-Stock

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8,620

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Digiode

USA . 2,456 parts In-Stock

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2,456

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 373 parts In-Stock

1+ parts

$11.000

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373

$11.000

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Parana Technologies

USA . 1,793 parts In-Stock

1+ parts

$14.634

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$15.072

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1,793

$14.634

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$15.072

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ChromeModa Solutions

Germany . 4,126 parts In-Stock

1+ parts

$16.443

100+ parts

$13.483

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4,126

$16.443

$13.483

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IDEA Electronic Components Group

UK . 1,585 parts In-Stock

1+ parts

$16.443

100+ parts

$15.621

1k+ parts

$14.799

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1,585

$16.443

$15.621

$14.799

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AZTECH Wire

Italy . 591 parts In-Stock

1+ parts

$19.562

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591

$19.562

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Ampacity Inc.

Singapore . 527 parts In-Stock

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$25.000

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527

$25.000

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Continental Prestige Electronics

USA . 4,373 parts In-Stock

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Argo Parts USA

USA . 3,828 parts In-Stock

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3,828

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DigiPath Technology Company

USA . 2,257 parts In-Stock

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$14.825

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2,257

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$14.825

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Corphita

USA . 1,734 parts In-Stock

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1,734

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Unlock unparalleled precision and efficiency with the TLC2552IDGKR by Texas Instruments. As a leading manufacturer in the Analog-to-Digital Converters category, Texas Instruments delivers top-notch quality and reliability. With 12 bits of data resolution and a maximum linearity error of only 0.0244%, this ADC offers exceptional performance for your applications. Whether you're working on industrial automation, sensor interfaces, or data acquisition systems, this product ensures accurate and fast conversions to meet your needs. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the Analog-to-Digital Converter.

No. of Analog In Channels: 2

Allows for the conversion of signals from 2 different analog input channels, providing versatility in usage.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving space and simplifying assembly processes.

No. of Bits: 12

Offers high resolution for accurate conversion of analog signals into digital data.

Maximum Linearity Error (EL): 0.0244 %

Ensures precise and reliable conversion with minimal error margin.

Power Supplies (V): 5

Operates on a standard voltage supply, making it compatible with most electronic systems.

No. of Terminals: 8

Facilitates easy connectivity and integration within electronic circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enables compact and space-saving design, ideal for applications with size constraints.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where high temperatures may be present.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme temperature conditions, increasing its versatility.

Terminal Position: DUAL

Provides multiple terminal positions for flexible and convenient connections.

Maximum Conversion Time: 2.77 us

Offers fast conversion speed, suitable for applications requiring real-time data processing.

Maximum Seated Height: 1.1 mm

Compact design allows for easy integration within tight spaces.

Width: 3 mm

Compact width dimension for fitting into small electronic devices.

Length: 3 mm

Compact length dimension for space-efficient circuit board design.

Temperature Grade: INDUSTRIAL

Designed for use in industrial environments with varying temperature ranges.

Maximum Analog Input Voltage: 5.5 V

Accepts a wide range of analog input voltages for versatile application compatibility.

Sample Rate: 0.36 MHz

High sample rate enables fast and accurate data conversion for time-critical applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and secure connections to circuit boards.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Utilizes successive approximation method for precise analog-to-digital conversion.

Nominal Supply Voltage: 5 V

Operates within a standard voltage range for easy integration with existing systems.

Output Bit Code: BINARY

Outputs digital data in binary format for compatibility with digital processing systems.

Terminal Pitch: 0.65 mm

Compact terminal pitch for efficient layout and connection on circuit boards.

Minimum Analog Input Voltage: 0 V

Capable of accurately converting low analog input voltages for a wide range of applications.

Output Format: SERIAL

Outputs digital data in serial format for easy transmission and compatibility with serial communication protocols.

Sample and Hold/Track and Hold: SAMPLE

Utilizes sample and hold function for capturing and retaining analog input signals during the conversion process.

Technical Specifications

Analog-to-Digital Converters TLC2552IDGKR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

360 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2.77 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP8,.19

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-G8

Qualified:

No

Trade Compliance

TLC2552IDGKR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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