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ADS1158IRTCTG4

Texas Instruments

ADS1158IRTCTG4 by Texas Instruments

Texas Instruments ADS1158IRTCTG4 is a 16-bit ADC with 0.0015% linearity error, operating at -40 to 105°C. It features 16 analog input channels, ±2.5/3.3V supplies, and a sample rate of 0.0237 MHz. Ideal for industrial applications requiring precise analog-to-digital conversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,371 parts In-Stock

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6,371

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Digiode

USA . 1,267 parts In-Stock

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1,267

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VNN

France . 1,196 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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AZTECH Wire

Italy . 379 parts In-Stock

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$7.018

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379

$7.018

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Parana Technologies

USA . 788 parts In-Stock

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$10.171

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$10.711

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788

$10.171

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$10.711

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ChromeModa Solutions

Germany . 4,639 parts In-Stock

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$11.428

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$9.371

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4,639

$11.428

$9.371

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IDEA Electronic Components Group

UK . 1,217 parts In-Stock

1+ parts

$11.428

100+ parts

$10.857

1k+ parts

$10.285

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1,217

$11.428

$10.857

$10.285

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$12.470

100+ parts

$11.847

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$11.847

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100

$12.470

$11.847

$11.847

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One Stop Electronics

USA . 1,392 parts In-Stock

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$14.000

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Ampacity Inc.

Singapore . 1,253 parts In-Stock

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$15.000

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$15.000

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Semicontronic

India . 1,271 parts In-Stock

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$16.000

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$15.600

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$15.520

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1,271

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Corohmni

South Africa . 1,138 parts In-Stock

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$16.057

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Continental Prestige Electronics

USA . 3,857 parts In-Stock

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Corphita

USA . 2,649 parts In-Stock

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Argo Parts USA

USA . 1,960 parts In-Stock

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DigiPath Technology Company

USA . 1,835 parts In-Stock

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$10.303

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$10.303

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Microchip USA

USA . 1,690 parts In-Stock

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1,690

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Unleash the power of precision with the ADS1158IRTCTG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Analog-to-Digital Converters that offer unparalleled accuracy and performance. With 16 analog input channels and a compact square package design, this versatile chip carrier is perfect for a wide range of industrial applications. Experience the benefits of reliable conversion, minimal linearity error, and low power consumption with the ADS1158IRTCTG4. Elevate your projects with Texas Instruments and see the difference in quality and efficiency today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and resistance to environmental factors, making it a reliable choice for various applications.

No. of Analog In Channels: 16

With 16 analog input channels, this product offers versatility and flexibility in capturing and converting analog signals, making it suitable for multi-channel data acquisition systems.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving space and simplifying the assembly process.

Package Shape: SQUARE

The square package shape facilitates uniform and compact integration into electronic systems, optimizing the use of available board space.

No. of Bits: 16

This product provides high resolution with 16 bits, ensuring precise and accurate digital conversion of analog signals for enhanced performance in various applications.

Maximum Linearity Error (EL): 0.0015 %

The low linearity error of 0.0015% guarantees accuracy and consistency in the conversion process, making it a reliable choice for demanding measurement applications.

Power Supplies (V): +-2.5,3.3

With dual power supply options of +-2.5V and 3.3V, this product offers flexibility and compatibility with a wide range of system configurations.

No. of Terminals: 48

The 48 terminals provide ample connection points, allowing for versatile integration and efficient signal routing in complex electronic systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles including chip carrier, heat sink/slug, and very thin profile offer customization options for specific design requirements, enhancing overall system performance.

Minimum Supply Voltage: 2.5 V

The low minimum supply voltage requirement of 2.5V ensures compatibility with a wide range of power sources, enabling flexible integration into different electronic setups.

Technical Specifications

Analog-to-Digital Converters ADS1158IRTCTG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

16

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0015 %

Sample Rate:

23.7 kHz

Electrical Specifications

Power Supplies:

±2.5,3.3 V

Minimum Analog Input Voltage:

-4.3417 V

Maximum Analog Input Voltage:

4.3417 V

Nominal Supply Voltage:

2.5 V

Nominal Negative Supply Voltage:

-2.5 V

Minimum Supply Voltage:

2.5 V

Maximum Supply Current:

12 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.035 in (0.9 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS1158IRTCTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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