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ADS1258IRTCRG4

Texas Instruments

ADS1258IRTCRG4 by Texas Instruments

ADS1258IRTCRG4 by Texas Instruments is a 24-bit ADC with 16 analog input channels, 0.125 MHz sample rate, and 0.001% max linearity error. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact chip carrier package with a temperature range of -40 to 105°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 8,720 parts In-Stock

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Vyrian

USA . 4,015 parts In-Stock

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France . 450 parts In-Stock

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450

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Digiode

USA . 415 parts In-Stock

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415

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Bristol Electronics

USA . 9 parts In-Stock

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Atlantic Semiconductor

USA . 9 parts In-Stock

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Ampacity Inc.

Singapore . 1,276 parts In-Stock

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$1.000

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$1.000

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AZTECH Wire

Italy . 250 parts In-Stock

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$5.381

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$5.381

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Corohmni

South Africa . 198 parts In-Stock

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$10.441

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Parana Technologies

USA . 388 parts In-Stock

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$17.671

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$1,641.016

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$15.904

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388

$17.671

$1,641.016

$15.904

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DigiPath Technology Company

USA . 294 parts In-Stock

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$19.458

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IDEA Electronic Components Group

UK . 518 parts In-Stock

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$19.855

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$18.862

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$17.870

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ChromeModa Solutions

Germany . 103 parts In-Stock

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$19.855

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$16.281

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Advanced Electronics

New Zealand . 650 parts In-Stock

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$22.619

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$21.488

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One Stop Electronics

USA . 1,459 parts In-Stock

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$23.000

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Semicontronic

India . 933 parts In-Stock

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$25.350

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$25.220

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Robosynatics

Brazil . 5,000 parts In-Stock

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Lucentia Tech

USA . 5,000 parts In-Stock

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$3.611

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Continental Prestige Electronics

USA . 4,721 parts In-Stock

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Argo Parts USA

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Corphita

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Bastille Electronics

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iodParts Technologies Inc.

India . 10 parts In-Stock

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Overview

Experience unparalleled precision and reliability with the Texas Instruments ADS1258IRTCRG4 Analog-to-Digital Converter. Crafted with top-notch quality materials and cutting-edge technology, this converter offers 24 bits of accuracy and a maximum linearity error of just 0.001%. With 16 analog input channels and a sample rate of 0.125 MHz, this product is ideal for industrial applications where precision is paramount. Trust Texas Instruments to deliver unmatched performance and value to meet your needs. Elevate your projects with the ADS1258IRTCRG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ideal for various applications.

No. of Analog In Channels: 16

With 16 analog input channels, this converter allows for versatile input connectivity options, catering to multiple signal sources.

Surface Mount: YES

Being surface mountable makes this product easy to integrate into compact circuit designs, saving space and reducing assembly time.

Package Shape: SQUARE

The square package shape offers a symmetrical and space-efficient design, suitable for applications where footprint size is crucial.

No. of Bits: 24

With 24 bits of resolution, this ADC provides high precision and accuracy in digitizing analog signals, perfect for demanding measurement tasks.

Maximum Linearity Error (EL): 0.001 %

The extremely low linearity error ensures that the output signal faithfully represents the input signal, making this converter highly reliable.

Power Supplies (V): +-2.5,3.3

The dual power supply support of +-2.5V and 3.3V enables flexibility in voltage requirements, allowing for compatibility with various systems.

No. of Terminals: 48

The abundance of terminals provides ample connectivity options and allows for easy interfacing with external components, enhancing the versatility of the product.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles, including chip carrier and heat sink/slug, offer different thermal management and mounting options to suit different application needs.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures reliable performance in harsh environmental conditions, making it suitable for industrial applications.

Technical Specifications

Analog-to-Digital Converters ADS1258IRTCRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

16

No. of Functions:

1

No. of Bits:

24

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.001 %

Sample Rate:

125 kHz

Electrical Specifications

Power Supplies:

±2.5,3.3 V

Minimum Analog Input Voltage:

-4.341 V

Maximum Analog Input Voltage:

4.341 V

Nominal Supply Voltage:

2.5 V

Nominal Negative Supply Voltage:

-2.5 V

Maximum Supply Current:

12 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.035 in (0.9 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS1258IRTCRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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