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OMAP3530DZCBBA

Texas Instruments

OMAP3530DZCBBA by Texas Instruments

OMAP3530DZCBBA by Texas Instruments is a Microprocessor with 26-bit Address Bus, 16-bit External Data Bus, and 600 rpm Speed. It is used in industrial applications requiring low power mode, featuring a max clock frequency of 59 MHz. The package style includes Grid Array, Very Thin Profile, and Fine Pitch for compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,779 parts In-Stock

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Vyrian

USA . 2,619 parts In-Stock

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One Stop Electronics

USA . 303 parts In-Stock

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$9.000

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AZTECH Wire

Italy . 815 parts In-Stock

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$15.217

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$54.964

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$50.017

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$45.070

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Parana Technologies

USA . 710 parts In-Stock

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$65.506

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IDEA Electronic Components Group

UK . 2,242 parts In-Stock

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$73.602

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$69.922

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$66.242

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ChromeModa Solutions

Germany . 981 parts In-Stock

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$73.602

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$60.354

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Component Stockers USA

USA . 607 parts In-Stock

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$99.990

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Corphita

USA . 4,014 parts In-Stock

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DigiPath Technology Company

USA . 1,363 parts In-Stock

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$66.360

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Microchip USA

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Overview

Experience the next level of performance with the OMAP3530DZCBBA microprocessor by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This microprocessor is designed to optimize speed and efficiency, making it ideal for a wide range of applications. Whether you're looking to enhance your gaming experience, streamline your industrial processes, or elevate your mobile devices, the OMAP3530DZCBBA offers unparalleled value and benefits. Upgrade to the OMAP3530DZCBBA today and take your innovations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material allows for high durability and good resistance to external elements, making the product suitable for a wide range of applications.

Integrated Cache: YES

Integrated cache helps in improving the processing speed and overall performance of the microprocessor by reducing access time to frequently used data.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during the manufacturing process.

Address Bus Width: 26

A wider address bus width of 26 bits allows for efficient address handling and memory access, enhancing the overall speed and performance of the microprocessor.

Package Shape: SQUARE

Square package shape helps in optimizing space utilization on the PCB, making it easier to design compact and efficient electronic systems.

Power Supplies (V): 1.1, 1.8, 3.3

Support for multiple power supply voltages ensures compatibility with a variety of power sources and allows for flexibility in system design and integration.

No. of Terminals: 515

A high number of terminals enable connectivity with various external components and peripherals, expanding the functionality and versatility of the microprocessor.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a very thin profile and fine pitch offers high reliability, efficient heat dissipation, and enhanced electrical performance, making the product suitable for demanding industrial applications.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance ensures reliable performance even in harsh environmental conditions, making the microprocessor suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance allows the microprocessor to function effectively in extreme cold environments, ensuring consistent performance in a wide range of operating conditions.

Technical Specifications

Microprocessors OMAP3530DZCBBA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Boundary Scan:

YES

Maximum Clock Frequency:

59 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

515

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Speed:

600 rpm

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

OMAP3530DZCBBA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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