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MSP430F6778IPZR

Texas Instruments

MSP430F6778IPZR by Texas Instruments

MSP430F6778IPZR by Texas Instruments is a 16-bit MCU with 524288 ROM words, 16384 RAM bytes, and max clock freq of 25 MHz. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor. Compatible with I2C, SPI, UART buses for versatile connectivity options.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,456 parts In-Stock

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Digiode

USA . 4,769 parts In-Stock

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4,769

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Distributors (Availability)

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AZTECH Wire

Italy . 775 parts In-Stock

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$14.652

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775

$14.652

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Parana Technologies

USA . 910 parts In-Stock

1+ parts

$23.884

100+ parts

$2,217.995

1k+ parts

$21.496

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910

$23.884

$2,217.995

$21.496

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DigiPath Technology Company

USA . 16 parts In-Stock

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$26.299

100+ parts

$24.195

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16

$26.299

$24.195

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ChromeModa Solutions

Germany . 6,375 parts In-Stock

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$26.836

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$22.006

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6,375

$26.836

$22.006

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IDEA Electronic Components Group

UK . 1,711 parts In-Stock

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$26.836

100+ parts

$25.494

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$24.152

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1,711

$26.836

$25.494

$24.152

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One Stop Electronics

USA . 1,317 parts In-Stock

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$32.000

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Corohmni

South Africa . 521 parts In-Stock

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$35.045

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521

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Corphita

USA . 2,847 parts In-Stock

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Microchip USA

USA . 302 parts In-Stock

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Overview

Experience innovative technology with the Texas Instruments MSP430F6778IPZR, a cutting-edge microprocessor circuit that offers unparalleled performance and reliability. With a focus on quality and precision, Texas Instruments delivers a product that exceeds expectations in a wide range of applications. From industrial automation to consumer electronics, this versatile device provides value and benefits to customers looking for a powerful and efficient solution. Trust in Texas Instruments to deliver advanced technology that meets your needs and elevates your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for convenient and efficient placement on circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply options.

Package Shape: SQUARE

Offers a compact design for space-saving applications.

Bit Size: 16

Suitable for handling moderate complexity processing tasks.

Power Supplies (V): 2/3.3

Compatible with common voltage levels for easy integration.

No. of Terminals: 100

Sufficient connectivity options for various external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a streamlined design and layout for optimized performance.

Minimum Supply Voltage: 1.8 V

Allows for operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments.

CPU Family: MSP430

Known for its energy efficiency and versatility in various applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides reliable electrical connections and corrosion resistance.

Terminal Position: QUAD

Facilitates easier soldering and mounting on PCBs.

ROM Words: 524288

Offers ample storage capacity for program code and data.

Maximum Seated Height: 1.6 mm

Low profile design for slim devices.

Width: 14 mm

Compact size for space-constrained applications.

Maximum Clock Frequency: 25 MHz

Fast processing capabilities for quick response times.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

Soldering temperature suitable for lead-free assembly.

Length: 14 mm

Balanced dimensions for efficient PCB layout.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial settings.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Includes integrated peripheral components for enhanced functionality.

RAM Bytes: 16384

Sufficient memory for storing variables and temporary data.

Technology: CMOS

Low power consumption and noise immunity for efficient operation.

Terminal Form: GULL WING

Secure and reliable connection for soldering.

Maximum Supply Current: 11.75 mA

Efficient power usage for extended battery life.

Nominal Supply Voltage: 3.3 V

Stable voltage supply for consistent performance.

ROM Programmability: FLASH

Allows for easy reprogramming of the read-only memory.

Bus Compatibility: I2C; SPI; UART

Supports popular communication interfaces for versatile connectivity.

Terminal Pitch: 0.5 mm

Fine pitch for precise placement and soldering on PCBs.

Moisture Sensitivity Level (MSL): 3

Tolerant to moderate moisture exposure during handling and storage.

Speed: 25 rpm

Suitable for processing data at a moderate speed.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6778IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6778IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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