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MSP430F67781IPEUR

Texas Instruments

MSP430F67781IPEUR by Texas Instruments

MSP430F67781IPEUR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words, 16384 RAM bytes, and operates at speeds up to 25 rpm. It is ideal for industrial applications requiring low power consumption and a wide temperature range (-40 to 85 °C), with a max supply voltage of 3.6 V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,665 parts In-Stock

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4,665

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Digiode

USA . 700 parts In-Stock

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700

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Distributors (Availability)

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AZTECH Wire

Italy . 242 parts In-Stock

1+ parts

$14.116

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242

$14.116

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One Stop Electronics

USA . 816 parts In-Stock

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$27.000

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816

$27.000

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Parana Technologies

USA . 818 parts In-Stock

1+ parts

$33.104

100+ parts

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$118.951

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818

$33.104

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$118.951

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Corohmni

South Africa . 370 parts In-Stock

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$35.884

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370

$35.884

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DigiPath Technology Company

USA . 546 parts In-Stock

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$36.452

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$33.536

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546

$36.452

$33.536

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ChromeModa Solutions

Germany . 2,264 parts In-Stock

1+ parts

$37.196

100+ parts

$30.501

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2,264

$37.196

$30.501

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IDEA Electronic Components Group

UK . 1,058 parts In-Stock

1+ parts

$37.196

100+ parts

$35.336

1k+ parts

$33.476

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1,058

$37.196

$35.336

$33.476

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Component Stockers USA

USA . 371 parts In-Stock

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$99.990

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371

$99.990

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Corphita

USA . 4,032 parts In-Stock

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Microchip USA

USA . 267 parts In-Stock

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F67781IPEUR! This cutting-edge microprocessor circuit offers unmatched quality and reliability, thanks to its reputable manufacturer. Ideal for a wide range of applications, this product provides customers with exceptional value, efficiency, and performance. Say goodbye to limitations and hello to endless possibilities with the MSP430F67781IPEUR by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for electronic components.

Surface Mount: YES

Easy to install and is space-saving in design.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Package Shape: RECTANGULAR

Compact shape for efficient use of space on a circuit board.

Bit Size: 16

Provides processing power suitable for various applications.

Power Supplies (V): 2/3.3

Supports multiple supply voltage options, accommodating different power requirements.

No. of Terminals: 128

Allows for connections to multiple external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Space-efficient package style for compact electronic designs.

Minimum Supply Voltage: 1.8 V

Can operate even with lower supply voltage, improving power efficiency.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments.

CPU Family: MSP430

Known for low power consumption and high processing performance.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides reliable electrical connections and prevents corrosion.

Terminal Position: QUAD

Quad terminal configuration for stable connections.

ROM Words: 524288

Large memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

Width: 14 mm

Compact width for efficient installation on a circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly process.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance for soldering.

Length: 20 mm

Moderate length for optimal placement on a PCB.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Includes additional peripheral circuits for enhanced functionality.

RAM Bytes: 16384

Adequate RAM capacity for data storage and processing.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for secure and reliable connections.

Maximum Supply Current: 11.75 mA

Efficient power usage with limited supply current.

Nominal Supply Voltage: 3.3 V

Stable and common supply voltage for reliable operation.

ROM Programmability: FLASH

Allows for easy reprogramming of ROM memory.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact design and reliable connections.

Moisture Sensitivity Level (MSL): 3

Moderate sensitivity to moisture, suitable for controlled environments.

Speed: 25 rpm

Processing speed of 25 rotations per minute for efficient performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67781IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

CPU Family:

MSP430

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67781IPEUR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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