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MSP430F67751AIPZ

Texas Instruments

MSP430F67751AIPZ by Texas Instruments

MSP430F67751AIPZ by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM channels, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$8.504

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,165 parts In-Stock

1+ parts

$8.504

100+ parts

$6.933

1k+ parts

$4.622

10k+ parts

-

7,165

$8.504

$6.933

$4.622

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,944 parts In-Stock

1+ parts

$8.079

100+ parts

-

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3,944

$8.079

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Vyrian

USA . 3,282 parts In-Stock

1+ parts

-

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3,282

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Chip Stock

USA . 2,800 parts In-Stock

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2,800

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LWI Electronics Inc

India . 53 parts In-Stock

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53

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,952 parts In-Stock

1+ parts

$7.654

100+ parts

-

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-

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3,952

$7.654

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AZTECH Wire

Italy . 694 parts In-Stock

1+ parts

$11.390

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694

$11.390

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Corohmni

South Africa . 2,939 parts In-Stock

1+ parts

$28.312

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-

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2,939

$28.312

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Microchip USA

USA . 2,866 parts In-Stock

1+ parts

$31.110

100+ parts

$30.660

1k+ parts

$30.440

10k+ parts

$30.220

2,866

$31.110

$30.660

$30.440

$30.220

Parana Technologies

USA . 1,503 parts In-Stock

1+ parts

$75.694

100+ parts

-

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1,503

$75.694

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ChromeModa Solutions

Germany . 3,891 parts In-Stock

1+ parts

$85.050

100+ parts

$69.741

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-

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3,891

$85.050

$69.741

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IDEA Electronic Components Group

UK . 2,124 parts In-Stock

1+ parts

$85.050

100+ parts

$80.798

1k+ parts

$76.545

10k+ parts

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2,124

$85.050

$80.798

$76.545

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Lixinc

USA . 11,824 parts In-Stock

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11,824

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DigiPath Technology Company

USA . 1,357 parts In-Stock

1+ parts

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100+ parts

$76.681

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1,357

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$76.681

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430F67751AIPZ microprocessor circuit. Designed for industrial-grade applications, this high-quality microcontroller offers unmatched performance and reliability. With features such as multiple ADC and DMA channels, as well as a wide range of connectivity options, this versatile device is perfect for a variety of functions. Experience seamless operation and optimal efficiency with the MSP430F67751AIPZ, providing you with value, benefits, and advantages that go beyond expectations. Trust Texas Instruments for top-notch quality and innovation in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for portable and rugged applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and can support a wide range of applications.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it ideal for battery-powered devices or applications requiring efficiency.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Having a microprocessor circuit as a peripheral IC allows for advanced functionality and processing capabilities, enhancing the overall performance of the product.

Maximum Clock Frequency: 0.032768 MHz

The high maximum clock frequency ensures fast and efficient processing of data, enabling the product to handle complex tasks quickly.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

The multiple connectivity options provided by I2C, IRDA, SPI, and UART allow for versatile communication with other devices or systems, enhancing the product's compatibility and functionality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67751AIPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67751AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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