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MSP430F67691IPEUR

Texas Instruments

MSP430F67691IPEUR by Texas Instruments

MSP430F67691IPEUR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 32768 RAM bytes. Operating at -40 to 85 °C, it has a max supply voltage of 3.6 V and consumes up to 11.75 mA current. Ideal for industrial applications requiring low power consumption and high performance in a compact package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,800 parts In-Stock

1+ parts

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2,800

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Digiode

USA . 1,765 parts In-Stock

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1,765

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,535 parts In-Stock

1+ parts

$16.204

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2,535

$16.204

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AZTECH Wire

Italy . 671 parts In-Stock

1+ parts

$18.417

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671

$18.417

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One Stop Electronics

USA . 326 parts In-Stock

1+ parts

$26.000

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326

$26.000

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Parana Technologies

USA . 1,603 parts In-Stock

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$48.541

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1,603

$48.541

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DigiPath Technology Company

USA . 1,393 parts In-Stock

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$53.450

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1,393

$53.450

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IDEA Electronic Components Group

UK . 1,510 parts In-Stock

1+ parts

$54.541

100+ parts

$51.814

1k+ parts

$49.087

10k+ parts

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1,510

$54.541

$51.814

$49.087

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ChromeModa Solutions

Germany . 1,397 parts In-Stock

1+ parts

$54.541

100+ parts

$44.724

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1,397

$54.541

$44.724

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Corphita

USA . 4,542 parts In-Stock

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4,542

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Microchip USA

USA . 416 parts In-Stock

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416

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the MSP430F67691IPEUR, a cutting-edge microprocessor circuit designed to meet your industrial needs. Whether you're looking for efficient power management, robust performance, or seamless integration, this versatile device delivers it all. With a wide range of applications in mind, from IoT devices to consumer electronics, the MSP430F67691IPEUR offers unmatched value and benefits that will elevate your projects to new heights. Trust in Texas Instruments to provide state-of-the-art technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the integrated circuits inside, ensuring reliable performance in various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Ability to handle a maximum supply voltage of 3.6 V provides flexibility in power supply options and compatibility with different systems.

Bit Size: 16

A 16-bit architecture enables faster processing and more complex operations compared to lower bit sizes, making this product suitable for demanding applications.

No. of Terminals: 128

Having 128 terminals allows for versatile connectivity options and integration with various peripherals and components, enhancing the functionality of the product.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can perform reliably in extreme cold conditions, making it suitable for a wide range of environments.

ROM Programmability: FLASH

Flash ROM programming capability allows for easy reprogramming and updating of firmware, providing flexibility and customization options for the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67691IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

CPU Family:

MSP430

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67691IPEUR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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