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MSP430F6768IPEUR

Texas Instruments

MSP430F6768IPEUR by Texas Instruments

MSP430F6768IPEUR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words, 16384 RAM bytes, and max clock frequency of 25 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities. Compatible with I2C, SPI, and UART bus interfaces for versatile connectivity options.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,402 parts In-Stock

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5,402

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Digiode

USA . 3,950 parts In-Stock

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3,950

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Distributors (Availability)

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AZTECH Wire

Italy . 882 parts In-Stock

1+ parts

$19.663

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882

$19.663

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One Stop Electronics

USA . 1,371 parts In-Stock

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$21.000

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1,371

$21.000

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Parana Technologies

USA . 1,089 parts In-Stock

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$58.971

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$58.971

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DigiPath Technology Company

USA . 848 parts In-Stock

1+ parts

$64.934

100+ parts

$59.739

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848

$64.934

$59.739

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ChromeModa Solutions

Germany . 6,767 parts In-Stock

1+ parts

$66.259

100+ parts

$54.332

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6,767

$66.259

$54.332

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IDEA Electronic Components Group

UK . 434 parts In-Stock

1+ parts

$66.259

100+ parts

$62.946

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$59.633

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434

$66.259

$62.946

$59.633

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Corohmni

South Africa . 1,966 parts In-Stock

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$81.125

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Corphita

USA . 3,760 parts In-Stock

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3,760

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Microchip USA

USA . 383 parts In-Stock

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Overview

Unlock the power of innovation with the MSP430F6768IPEUR by Texas Instruments. This top-of-the-line product offers unmatched quality and reliability, backed by the reputable manufacturer's commitment to excellence. Ideal for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category, this product delivers exceptional value and performance. Experience seamless operation, advanced features, and superior efficiency with the MSP430F6768IPEUR, setting new standards in the industry. Elevate your projects to new heights with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, which is ideal for portable devices.

Surface Mount: YES

Being surface mountable provides ease of assembly and efficient use of PCB space, making it suitable for compact designs.

Maximum Supply Voltage: 3.6V

The high maximum supply voltage allows for flexibility in power supply options, enhancing the versatility of the product.

Package Shape: RECTANGULAR

The rectangular package shape is a common and convenient form factor for integration into various electronic systems.

Bit Size: 16

A 16-bit architecture offers higher processing capabilities and precision, making the product suitable for complex applications.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages (2V and 3.3V) enables compatibility with a wide range of power sources and circuits.

No. of Terminals: 128

The high number of terminals allows for a greater degree of connectivity and functionality in the device.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enables high-density mounting and efficient use of board space.

Minimum Supply Voltage: 1.8V

The low minimum supply voltage ensures efficient power consumption and operation in low-power environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and extended use.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it suitable for energy-efficient applications.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40°C to 85°C) allows for reliable operation in both extreme cold and hot conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

The quad terminal position provides stable mounting and secure connections, enhancing the product's reliability.

ROM Words: 524288

The large ROM capacity of 524288 words allows for storing a significant amount of program data and instructions.

Maximum Seated Height: 1.6mm

With a low seated height of 1.6mm, the product is suitable for slim and compact electronic devices.

Width: 14mm

The compact width of 14mm makes the product space-efficient and suitable for small form factor designs.

Maximum Clock Frequency: 25MHz

A high maximum clock frequency of 25MHz enables fast processing and data transfer speeds, ideal for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering and robust connections.

Length: 20mm

The moderate length of 20mm provides a balance between compactness and functionality in the product design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit as a peripheral IC type adds advanced processing capabilities and functionality to the product.

RAM Bytes: 16384

The 16384 bytes of RAM provide ample storage for temporary data and variables during operation, enhancing computational efficiency.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and reliable connections, simplifying the assembly process.

Maximum Supply Current: 11.75mA

The low maximum supply current of 11.75mA contributes to energy efficiency and prolonged battery life in power-constrained applications.

Nominal Supply Voltage: 3.3V

The 3.3V nominal supply voltage ensures compatibility with standard power sources and stable performance throughout the product's lifespan.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and efficient reprogramming of the memory contents, enabling software updates and customization.

Bus Compatibility: I2C; SPI; UART

Support for multiple bus protocols (I2C, SPI, UART) enhances connectivity and interoperability with other devices, expanding the product's application range.

Terminal Pitch: 0.5mm

The fine terminal pitch of 0.5mm enables high-density mounting and precise connections, suitable for compact PCB designs.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates moderate sensitivity to moisture during storage and handling, requiring appropriate precautions.

Speed: 25rpm

The speed rating of 25rpm highlights the product's capability to perform operations at a consistent and controlled speed, ensuring reliable functionality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6768IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6768IPEUR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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