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MSP430F6768AIPZR

Texas Instruments

MSP430F6768AIPZR by Texas Instruments

MSP430F6768AIPZR by Texas Instruments is a 16-bit microprocessor with 6-Ch 10-Bit ADC channels, 3 DMA channels, and BOR peripherals. It operates at a max frequency of 0.032768 MHz and has ROM words of 524288 for industrial applications requiring low power consumption. The package style is flatpack with a terminal pitch of 0.5 mm.

Median Price

$8.551

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,550 parts In-Stock

1+ parts

$8.551

100+ parts

$7.469

1k+ parts

$5.151

10k+ parts

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2,550

$8.551

$7.469

$5.151

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,889 parts In-Stock

1+ parts

$8.123

100+ parts

-

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4,889

$8.123

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Vyrian

USA . 7,450 parts In-Stock

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7,450

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,188 parts In-Stock

1+ parts

$7.270

100+ parts

-

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2,188

$7.270

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Corphita

USA . 1,468 parts In-Stock

1+ parts

$7.696

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1,468

$7.696

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Corohmni

South Africa . 2,041 parts In-Stock

1+ parts

$7.878

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2,041

$7.878

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AZTECH Wire

Italy . 968 parts In-Stock

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$14.360

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968

$14.360

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Microchip USA

USA . 3,544 parts In-Stock

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$23.755

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3,544

$23.755

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Parana Technologies

USA . 507 parts In-Stock

1+ parts

$44.294

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507

$44.294

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IDEA Electronic Components Group

UK . 2,081 parts In-Stock

1+ parts

$49.768

100+ parts

$47.280

1k+ parts

$44.791

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2,081

$49.768

$47.280

$44.791

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ChromeModa Solutions

Germany . 941 parts In-Stock

1+ parts

$49.768

100+ parts

$40.810

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941

$49.768

$40.810

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DigiPath Technology Company

USA . 953 parts In-Stock

1+ parts

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100+ parts

$44.871

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953

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$44.871

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Overview

Experience unparalleled performance and reliability with the Texas Instruments MSP430F6768AIPZR, a top-of-the-line microprocessor circuit designed for industrial-grade applications. With an impressive array of peripherals including BOR, comparator, DMA, RTC, and multiple timers, this CMOS technology-based device offers seamless connectivity through I2C, IRDA, SPI, and UART interfaces. Boasting a robust design and a wide operating temperature range, this 16-bit chip ensures optimal functionality even in harsh environments. Trust in Texas Instruments' proven track record of excellence and unlock a world of possibilities with the MSP430F6768AIPZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Supports a maximum voltage of 3.6V, making it versatile for various power supply configurations.

Package Shape: SQUARE

Square shape simplifies PCB layout and allows for efficient use of board space.

Bit Size: 16

16-bit architecture provides greater processing power and precision for applications requiring higher performance.

No. of Terminals: 100

Ample number of terminals allow for versatile connectivity options and integration with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style enables low-profile design and high-density PCB integration.

Minimum Supply Voltage: 2.4 V

Supports a minimum voltage of 2.4V, ensuring compatibility with a wide range of power sources while maintaining stable operation.

Maximum Operating Temperature: 85 °C

Operational at temperatures up to 85°C, suitable for industrial environments with varying temperature conditions.

CPU Family: MSP430

Belonging to the MSP430 family ensures compatibility with existing MSP430-based systems and tools, simplifying integration and development.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6768AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6768AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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