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MSP430F6768AIPEUR

Texas Instruments

MSP430F6768AIPEUR by Texas Instruments

MSP430F6768AIPEUR by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at up to 0.032768 MHz. It features 6 ADC channels, 3 DMA channels, and peripherals like BOR and RTC. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$9.321

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,732 parts In-Stock

1+ parts

$9.321

100+ parts

$8.142

1k+ parts

$5.615

10k+ parts

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2,732

$9.321

$8.142

$5.615

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,483 parts In-Stock

1+ parts

$8.855

100+ parts

-

1k+ parts

-

10k+ parts

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1,483

$8.855

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Vyrian

USA . 7,309 parts In-Stock

1+ parts

-

100+ parts

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7,309

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Chip Stock

USA . 3,700 parts In-Stock

1+ parts

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3,700

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 343 parts In-Stock

1+ parts

$8.389

100+ parts

-

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343

$8.389

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-

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Corohmni

South Africa . 960 parts In-Stock

1+ parts

$9.049

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-

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960

$9.049

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AZTECH Wire

Italy . 168 parts In-Stock

1+ parts

$12.410

100+ parts

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168

$12.410

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Microchip USA

USA . 2,558 parts In-Stock

1+ parts

$23.020

100+ parts

$22.700

1k+ parts

$22.530

10k+ parts

$22.370

2,558

$23.020

$22.700

$22.530

$22.370

Parana Technologies

USA . 1,967 parts In-Stock

1+ parts

$37.366

100+ parts

-

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1,967

$37.366

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IDEA Electronic Components Group

UK . 1,834 parts In-Stock

1+ parts

$41.984

100+ parts

$39.885

1k+ parts

$37.786

10k+ parts

-

1,834

$41.984

$39.885

$37.786

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ChromeModa Solutions

Germany . 733 parts In-Stock

1+ parts

$41.984

100+ parts

$34.427

1k+ parts

-

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733

$41.984

$34.427

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DigiPath Technology Company

USA . 879 parts In-Stock

1+ parts

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100+ parts

$37.853

1k+ parts

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10k+ parts

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879

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$37.853

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Overview

Unlock the power of technology with the Texas Instruments MSP430F6768AIPEUR microprocessor circuit. Designed with precision and innovation, this product offers unmatched quality and reliability for a wide range of applications. With its advanced features and flexible connectivity options, this microprocessor circuit provides customers with unparalleled value and performance. Trust in Texas Instruments to deliver cutting-edge solutions that meet your needs and exceed your expectations. Experience the difference with the MSP430F6768AIPEUR and revolutionize the way you approach your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of systems.

No. of Terminals: 128

Offers a sufficient number of connections for various inputs and outputs, enhancing versatility.

ROM Words: 524288

Large ROM capacity allows for ample program storage and flexibility in software applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Having a dedicated microprocessor circuit enhances processing efficiency and overall performance of the product.

Nominal Supply Voltage: 3.3 V

Stable supply voltage ensures reliable operation and consistent performance of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6768AIPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6768AIPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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