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MSP430F6766IPZ

Texas Instruments

MSP430F6766IPZ by Texas Instruments

MSP430F6766IPZ by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16 RAM words. Operating at up to 25 MHz, it has ADC channels, I2C/SPI/UART bus compatibility, and operates in industrial temperature range. Ideal for applications requiring low power consumption and high performance in a compact form factor.

Median Price

$8.068

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 740 parts In-Stock

1+ parts

$8.068

100+ parts

$6.578

1k+ parts

$4.385

10k+ parts

-

740

$8.068

$6.578

$4.385

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,172 parts In-Stock

1+ parts

$7.665

100+ parts

-

1k+ parts

-

10k+ parts

-

4,172

$7.665

-

-

-

Vyrian

USA . 5,636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,636

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,334 parts In-Stock

1+ parts

$7.261

100+ parts

-

1k+ parts

-

10k+ parts

-

4,334

$7.261

-

-

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Corohmni

South Africa . 2,133 parts In-Stock

1+ parts

$10.400

100+ parts

-

1k+ parts

-

10k+ parts

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2,133

$10.400

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-

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Ampacity Inc.

Singapore . 393 parts In-Stock

1+ parts

$14.930

100+ parts

-

1k+ parts

-

10k+ parts

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393

$14.930

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-

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AZTECH Wire

Italy . 1,104 parts In-Stock

1+ parts

$20.490

100+ parts

-

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10k+ parts

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1,104

$20.490

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Microchip USA

USA . 1,698 parts In-Stock

1+ parts

$22.070

100+ parts

$21.760

1k+ parts

$21.600

10k+ parts

$21.440

1,698

$22.070

$21.760

$21.600

$21.440

Parana Technologies

USA . 937 parts In-Stock

1+ parts

$59.504

100+ parts

-

1k+ parts

-

10k+ parts

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937

$59.504

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DigiPath Technology Company

USA . 509 parts In-Stock

1+ parts

$65.521

100+ parts

-

1k+ parts

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509

$65.521

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ChromeModa Solutions

Germany . 2,287 parts In-Stock

1+ parts

$66.858

100+ parts

$54.824

1k+ parts

-

10k+ parts

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2,287

$66.858

$54.824

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IDEA Electronic Components Group

UK . 2,155 parts In-Stock

1+ parts

$66.858

100+ parts

$63.515

1k+ parts

$60.172

10k+ parts

-

2,155

$66.858

$63.515

$60.172

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Overview

Unleash the power of cutting-edge technology with the Texas Instruments MSP430F6766IPZ microprocessor circuit. Designed for industrial-grade applications, this high-quality product offers customers a reliable and efficient solution for their embedded system needs. With a maximum clock frequency of 25 MHz and a flash ROM programmability, the MSP430F6766IPZ delivers top-notch performance and versatility. Whether you're working on IoT devices, smart sensors, or automation systems, this microprocessor will exceed your expectations. Upgrade your projects today with Texas Instruments' innovative MSP430F6766IPZ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the package, ensuring the product's longevity.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various electronic devices.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage tolerance offers flexibility in power supply options and compatibility with different systems.

Package Shape: SQUARE

Square package shape enables efficient use of space and easy placement within designs.

Bit Size: 16

16-bit architecture provides enhanced computational capabilities for processing complex instructions and data.

Power Supplies (V): 2/3.3

Dual power supply options ensure compatibility with different voltage standards and enhance versatility of the product.

No. of Terminals: 100

High number of terminals allows for connectivity to various peripherals and components, increasing the product's functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style enables easy assembly, compact design, and precise positioning on circuit boards.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage requirement helps in reducing power consumption and extends the product's battery life.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the product to function reliably in various environmental conditions.

CPU Family: MSP430

Utilizing the MSP430 CPU family provides efficient processing power and performance for the product.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can function in extreme cold conditions without any performance issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers excellent conductivity and resistance to corrosion, ensuring reliable connections.

ADC Channels: YES

Integrated ADC channels allow for analog signal conversion, expanding the product's capabilities in processing real-world data.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections, enhancing the product's overall reliability.

ROM Words: 262144

Large ROM capacity of 262144 words allows for storing extensive program instructions and data, enabling complex operations.

Maximum Seated Height: 1.6 mm

Low maximum seated height ensures compatibility with slim and compact designs, saving space in electronic devices.

RAM Words: 16

Although small, 16 RAM words provide temporary storage for critical data, supporting efficient processing and operation.

Width: 14 mm

Compact width of 14mm enables the product to be easily integrated into tight spaces within electronic systems.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency of 25 MHz allows for fast data processing and execution of instructions, enhancing overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature of 30 seconds allows for proper soldering and ensures secure mounting on circuit boards.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures reliable solder joints and lasting connections during the manufacturing process.

Length: 14 mm

Short length of 14mm makes the product compact and suitable for space-constrained electronic applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates the product can withstand harsh operating conditions typically found in industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit provides additional functionality and processing power to the product, expanding its potential applications.

RAM Bytes: 16384

Large RAM capacity of 16384 bytes allows for efficient data storage during operation, enhancing processing speed and performance.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high speed, and reliability, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form ensures secure and reliable soldering connections during the manufacturing process, improving overall product durability.

Maximum Supply Current: 11.75 mA

Low maximum supply current of 11.75 mA helps in reducing power consumption and heat generation, enhancing the product's efficiency.

Nominal Supply Voltage: 3.3 V

Stable and commonly used nominal supply voltage of 3.3V ensures compatibility with a wide range of systems and power sources.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating of firmware and software, ensuring flexibility and adaptability for future enhancements.

Bus Compatibility: I2C; SPI; UART

Support for I2C, SPI, and UART bus protocols ensures connectivity with various devices and peripherals, expanding the product's versatility.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5mm enables precise mounting and soldering, facilitating high-density packaging and miniaturization of electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates the product can withstand multiple soldering processes without degradation, ensuring long-term reliability.

Speed: 25 rpm

High speed of 25 rpm accelerates data processing and overall system performance, making the product suitable for fast and real-time applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6766IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6766IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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