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MSP430F6766IPEUR

Texas Instruments

MSP430F6766IPEUR by Texas Instruments

MSP430F6766IPEUR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words, 16384 RAM bytes, and a max clock frequency of 25 MHz. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,226 parts In-Stock

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4,226

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Vyrian

USA . 3,529 parts In-Stock

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3,529

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Distributors (Availability)

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AZTECH Wire

Italy . 847 parts In-Stock

1+ parts

$14.940

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847

$14.940

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One Stop Electronics

USA . 1,539 parts In-Stock

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$24.000

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1,539

$24.000

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Corohmni

South Africa . 3,105 parts In-Stock

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$66.821

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3,105

$66.821

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Parana Technologies

USA . 547 parts In-Stock

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$72.256

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547

$72.256

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DigiPath Technology Company

USA . 1,144 parts In-Stock

1+ parts

$79.562

100+ parts

$73.197

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1,144

$79.562

$73.197

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ChromeModa Solutions

Germany . 4,956 parts In-Stock

1+ parts

$81.186

100+ parts

$66.573

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4,956

$81.186

$66.573

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IDEA Electronic Components Group

UK . 996 parts In-Stock

1+ parts

$81.186

100+ parts

$77.127

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$73.067

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996

$81.186

$77.127

$73.067

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Corphita

USA . 2,313 parts In-Stock

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Microchip USA

USA . 350 parts In-Stock

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350

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F6766IPEUR. This cutting-edge microprocessor circuit offers unparalleled quality and reliability, backed by the trusted name of Texas Instruments. Ideal for a wide range of applications, this high-performance IC provides customers with unmatched value, efficiency, and versatility. From its robust construction to its advanced technology, the MSP430F6766IPEUR is the perfect solution for your next project. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 3.6 V

Supports a higher voltage range, providing flexibility in power supply options.

Bit Size: 16

Offers a good balance between processing power and efficiency for a wide range of tasks.

No. of Terminals: 128

Provides ample connectivity options for interfacing with other components in a system.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, making it suitable for industrial applications.

CPU Family: MSP430

Comes from a reputable and reliable CPU family, ensuring quality and performance.

ROM Words: 262144

Offers a large storage capacity for program instructions, allowing for complex operations.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Includes additional circuits for interfacing with other devices, enhancing the functionality of the IC.

ROM Programmability: FLASH

Allows for reprogramming of the ROM, enabling flexibility and future updates to the software.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6766IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6766IPEUR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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