Loading...

MSP430F6766AIPZR

Texas Instruments

MSP430F6766AIPZR by Texas Instruments

MSP430F6766AIPZR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM channels, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$6.344

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,500 parts In-Stock

1+ parts

$6.344

100+ parts

$5.172

1k+ parts

$3.448

10k+ parts

-

2,500

$6.344

$5.172

$3.448

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,970 parts In-Stock

1+ parts

$6.027

100+ parts

-

1k+ parts

-

10k+ parts

-

2,970

$6.027

-

-

-

Vyrian

USA . 4,339 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,339

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,354 parts In-Stock

1+ parts

$5.313

100+ parts

-

1k+ parts

-

10k+ parts

-

2,354

$5.313

-

-

-

Corphita

USA . 3,212 parts In-Stock

1+ parts

$5.710

100+ parts

-

1k+ parts

-

10k+ parts

-

3,212

$5.710

-

-

-

AZTECH Wire

Italy . 303 parts In-Stock

1+ parts

$14.480

100+ parts

-

1k+ parts

-

10k+ parts

-

303

$14.480

-

-

-

Microchip USA

USA . 2,624 parts In-Stock

1+ parts

$30.560

100+ parts

$30.370

1k+ parts

$30.280

10k+ parts

$30.180

2,624

$30.560

$30.370

$30.280

$30.180

Parana Technologies

USA . 263 parts In-Stock

1+ parts

$39.802

100+ parts

-

1k+ parts

-

10k+ parts

-

263

$39.802

-

-

-

ChromeModa Solutions

Germany . 3,876 parts In-Stock

1+ parts

$44.721

100+ parts

$36.671

1k+ parts

-

10k+ parts

-

3,876

$44.721

$36.671

-

-

IDEA Electronic Components Group

UK . 1,995 parts In-Stock

1+ parts

$44.721

100+ parts

$42.485

1k+ parts

$40.249

10k+ parts

-

1,995

$44.721

$42.485

$40.249

-

DigiPath Technology Company

USA . 1,782 parts In-Stock

1+ parts

-

100+ parts

$40.320

1k+ parts

-

10k+ parts

-

1,782

-

$40.320

-

-

Overview

Unlock the power of innovation with the Texas Instruments MSP430F6766AIPZR microprocessor circuit. Designed with cutting-edge technology and high-quality materials, this industrial-grade solution offers a wide range of applications for your projects. With features like multiple ADC and DMA channels, along with connectivity options like I2C and SPI, this microprocessor provides unparalleled flexibility and performance. Experience seamless integration and reliable operation with the MSP430 family, delivering value and benefits that exceed expectations. Elevate your designs with Texas Instruments and discover endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, allowing for easy handling and longer lifespan.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, providing flexibility in various applications.

CPU Family: MSP430

Being part of the MSP430 CPU family ensures compatibility with existing systems and software, making it easy to integrate into projects.

ADC Channels: YES

The presence of Analog to Digital Converter channels enables accurate and efficient conversion of analog signals to digital data, enhancing the product's functionality.

RAM Words: 16

Having 16 RAM words allows for quick data processing and storage, improving the overall performance of the product.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Utilizing a microprocessor circuit as a peripheral IC ensures advanced processing capabilities and enhanced functionality, making the product a high-performance choice.

Technology: CMOS

The use of CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for long-term use.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6766AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6766AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20