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MSP430F67661IPZ

Texas Instruments

MSP430F67661IPZ by Texas Instruments

MSP430F67661IPZ by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it supports I2C, SPI, UART bus compatibility for industrial applications requiring low power consumption. The package style is flatpack with a low profile and fine pitch design.

Median Price

$9.440

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,543 parts In-Stock

1+ parts

$7.619

100+ parts

$6.212

1k+ parts

$4.141

10k+ parts

-

1,543

$7.619

$6.212

$4.141

-

DigiKey

USA . 177 parts In-Stock

1+ parts

$9.440

100+ parts

$6.294

1k+ parts

$5.802

10k+ parts

$5.669

177

$9.440

$6.294

$5.802

$5.669

Mouser Electronics

USA . 7 parts In-Stock

1+ parts

$9.440

100+ parts

$6.070

1k+ parts

$5.660

10k+ parts

-

7

$9.440

$6.070

$5.660

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,611 parts In-Stock

1+ parts

$7.238

100+ parts

-

1k+ parts

-

10k+ parts

-

1,611

$7.238

-

-

-

Vyrian

USA . 6,529 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,529

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,264 parts In-Stock

1+ parts

$6.857

100+ parts

-

1k+ parts

-

10k+ parts

-

3,264

$6.857

-

-

-

Corohmni

South Africa . 2,473 parts In-Stock

1+ parts

$10.400

100+ parts

-

1k+ parts

-

10k+ parts

-

2,473

$10.400

-

-

-

Microchip USA

USA . 2,747 parts In-Stock

1+ parts

$20.850

100+ parts

$20.550

1k+ parts

$20.400

10k+ parts

$20.250

2,747

$20.850

$20.550

$20.400

$20.250

Parana Technologies

USA . 2,063 parts In-Stock

1+ parts

$70.220

100+ parts

-

1k+ parts

-

10k+ parts

-

2,063

$70.220

-

-

-

DigiPath Technology Company

USA . 1,209 parts In-Stock

1+ parts

$77.321

100+ parts

$71.135

1k+ parts

-

10k+ parts

-

1,209

$77.321

$71.135

-

-

ChromeModa Solutions

Germany . 2,661 parts In-Stock

1+ parts

$78.899

100+ parts

$64.697

1k+ parts

-

10k+ parts

-

2,661

$78.899

$64.697

-

-

IDEA Electronic Components Group

UK . 2,324 parts In-Stock

1+ parts

$78.899

100+ parts

$74.954

1k+ parts

$71.009

10k+ parts

-

2,324

$78.899

$74.954

$71.009

-

Overview

Unleash the power of innovation with the Texas Instruments MSP430F67661IPZ microprocessor circuit. This cutting-edge product offers unparalleled quality and reliability, backed by the trusted reputation of Texas Instruments. Ideal for a wide range of applications, this device provides customers with enhanced functionality, increased efficiency, and seamless integration. Elevate your projects to new heights with the MSP430F67661IPZ and experience the value and benefits that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the integrated circuits inside, making the product reliable for long-term use.

Surface Mount: YES

Being surface mountable makes it easy to integrate into circuit boards, saving space and reducing assembly complexity.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power input, accommodating various system requirements.

Package Shape: SQUARE

The square shape allows for easy placement and routing on circuit boards, optimizing space utilization.

Bit Size: 16

With a 16-bit architecture, the product can handle complex operations and calculations efficiently.

Power Supplies (V): 2/3.3

Supporting multiple power supply options ensures compatibility with different systems, enhancing versatility.

No. of Terminals: 100

Having a high number of terminals enables connectivity to various external components, expanding the product's functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style offers a compact design with improved thermal performance, ideal for space-constrained applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for efficient power consumption and operation in energy-sensitive applications.

Maximum Operating Temperature: 85 °C

Being able to operate at high temperatures ensures reliability in harsh environmental conditions or industrial settings.

CPU Family: MSP430

The MSP430 CPU family is known for low power consumption and high performance, making the product suitable for energy-efficient designs.

Minimum Operating Temperature: -40 °C

The ability to operate at extremely low temperatures makes the product suitable for a wide range of applications, including outdoor or automotive use.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish enhances conductivity and corrosion resistance, ensuring stable electrical connections for consistent performance.

ADC Channels: YES

Having ADC channels allows for analog-to-digital conversion, essential for interfacing with sensors or other analog devices.

Terminal Position: QUAD

Quad terminal positioning simplifies soldering and assembly, improving manufacturing efficiency.

ROM Words: 262144

With a large ROM capacity, the product can store substantial program code or data, facilitating complex applications.

Maximum Seated Height: 1.6 mm

The low seated height enables a slim profile, making the product suitable for compact designs or applications with height restrictions.

RAM Words: 16

Although limited, the RAM capacity allows for temporary data storage for efficient processing.

Width: 14 mm

The compact width makes the product versatile for different board layouts and space-constrained designs.

Maximum Time At Peak Reflow Temperature (s): 30

This feature ensures proper reflow soldering during assembly, contributing to reliable and consistent product performance.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature tolerance, the product can withstand reflow soldering processes without damage.

Length: 14 mm

The compact length complements the overall small form factor, aiding in space-saving integration and layout flexibility.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges ensures the product's reliability and performance in demanding operational conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities and functionality for diverse applications.

RAM Bytes: 16384

With a substantial RAM capacity, the product can efficiently handle data storage and manipulation for various tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving the product's efficiency and reliability.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and enhances mechanical strength for reliable electrical connections.

Maximum Supply Current: 11.75 mA

The relatively low supply current requirement contributes to energy efficiency and extended battery life in portable devices.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage provides stable power input for consistent performance and reliable operation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating or customization of firmware, enhancing product adaptability and versatility.

Bus Compatibility: I2C; SPI; UART

Supporting multiple bus interfaces enables seamless integration with various devices or systems, enhancing connectivity and interoperability.

Terminal Pitch: 0.5 mm

The fine pitch terminal spacing accommodates high-density board designs, maximizing connectivity options and space efficiency.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during assembly and storage.

Speed: 25 rpm

With a speed rating of 25 rpm, the product offers efficient data processing and high performance for various applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67661IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67661IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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