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MSP430F67661AIPZR

Texas Instruments

MSP430F67661AIPZR by Texas Instruments

MSP430F67661AIPZR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM channels, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$6.716

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,101 parts In-Stock

1+ parts

$6.716

100+ parts

$5.475

1k+ parts

$3.650

10k+ parts

-

6,101

$6.716

$5.475

$3.650

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,334 parts In-Stock

1+ parts

$6.380

100+ parts

-

1k+ parts

-

10k+ parts

-

2,334

$6.380

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-

-

Chip Stock

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,500

-

-

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Vyrian

USA . 3,317 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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3,317

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,072 parts In-Stock

1+ parts

$6.044

100+ parts

-

1k+ parts

-

10k+ parts

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1,072

$6.044

-

-

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AZTECH Wire

Italy . 933 parts In-Stock

1+ parts

$21.690

100+ parts

-

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-

10k+ parts

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933

$21.690

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-

-

Microchip USA

USA . 2,849 parts In-Stock

1+ parts

$32.350

100+ parts

$32.150

1k+ parts

$32.050

10k+ parts

$31.950

2,849

$32.350

$32.150

$32.050

$31.950

Corohmni

South Africa . 2,010 parts In-Stock

1+ parts

$35.522

100+ parts

-

1k+ parts

-

10k+ parts

-

2,010

$35.522

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-

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Parana Technologies

USA . 1,200 parts In-Stock

1+ parts

$65.581

100+ parts

-

1k+ parts

-

10k+ parts

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1,200

$65.581

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-

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DigiPath Technology Company

USA . 1,134 parts In-Stock

1+ parts

$72.212

100+ parts

-

1k+ parts

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10k+ parts

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1,134

$72.212

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-

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ChromeModa Solutions

Germany . 1,560 parts In-Stock

1+ parts

$73.686

100+ parts

$60.423

1k+ parts

-

10k+ parts

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1,560

$73.686

$60.423

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-

IDEA Electronic Components Group

UK . 17 parts In-Stock

1+ parts

$73.686

100+ parts

$70.002

1k+ parts

$66.317

10k+ parts

-

17

$73.686

$70.002

$66.317

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Component Stockers USA

USA . 276 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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276

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Overview

Discover the cutting-edge MSP430F67661AIPZR by Texas Instruments, setting a new standard in performance and reliability. This high-quality microprocessor circuit is designed to excel in a variety of applications, offering customers unparalleled value and benefits. With advanced peripherals like DMA, RTC, and multiple timers, this industrial-grade IC provides seamless connectivity through I2C, IRDA, SPI, and UART interfaces. Experience the innovation and efficiency of the MSP430 family with this feature-rich product, guaranteed to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and ability to protect the internal circuits from external elements, making the product reliable.

Surface Mount: YES

Surface mount technology allows for compact and efficient placement of the component on a PCB, saving space and improving overall circuit design.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows the product to operate efficiently in various power supply environments, increasing its versatility.

Bit Size: 16

A 16-bit architecture offers higher computational capabilities and precision, making the product suitable for complex tasks and calculations.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing power and enables it to handle multiple tasks simultaneously, making it a versatile choice for various applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67661AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67661AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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