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MSP430F67641IPN

Texas Instruments

MSP430F67641IPN by Texas Instruments

MSP430F67641IPN by Texas Instruments is an 80-terminal microprocessor circuit with 8192 bytes of RAM. Operating at -40 to 85°C, it supports I2C, SPI, and UART bus compatibility. Ideal for industrial applications requiring a low-profile, fine-pitch package style with a max supply voltage of 3.6V.

Median Price

$9.059

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,963 parts In-Stock

1+ parts

$6.598

100+ parts

$5.379

1k+ parts

$3.586

10k+ parts

-

2,963

$6.598

$5.379

$3.586

-

Mouser Electronics

USA . 115 parts In-Stock

1+ parts

$11.520

100+ parts

$8.540

1k+ parts

$5.970

10k+ parts

$5.790

115

$11.520

$8.540

$5.970

$5.790

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,737 parts In-Stock

1+ parts

$6.268

100+ parts

-

1k+ parts

-

10k+ parts

-

1,737

$6.268

-

-

-

Vyrian

USA . 6,396 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,396

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 673 parts In-Stock

1+ parts

$5.938

100+ parts

-

1k+ parts

-

10k+ parts

-

673

$5.938

-

-

-

Microchip USA

USA . 1,025 parts In-Stock

1+ parts

$18.050

100+ parts

$17.790

1k+ parts

$17.660

10k+ parts

$17.540

1,025

$18.050

$17.790

$17.660

$17.540

Parana Technologies

USA . 1,756 parts In-Stock

1+ parts

$55.606

100+ parts

-

1k+ parts

-

10k+ parts

-

1,756

$55.606

-

-

-

ChromeModa Solutions

Germany . 1,703 parts In-Stock

1+ parts

$62.479

100+ parts

$51.233

1k+ parts

-

10k+ parts

-

1,703

$62.479

$51.233

-

-

IDEA Electronic Components Group

UK . 1,079 parts In-Stock

1+ parts

$62.479

100+ parts

$59.355

1k+ parts

$56.231

10k+ parts

-

1,079

$62.479

$59.355

$56.231

-

Corohmni

South Africa . 411 parts In-Stock

1+ parts

$86.665

100+ parts

-

1k+ parts

-

10k+ parts

-

411

$86.665

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 4,838 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,838

-

-

-

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DigiPath Technology Company

USA . 2,277 parts In-Stock

1+ parts

-

100+ parts

$56.331

1k+ parts

-

10k+ parts

-

2,277

-

$56.331

-

-

Overview

Unleash the power of innovation with the Texas Instruments MSP430F67641IPN. This cutting-edge microprocessor circuit offers unparalleled quality and reliability, thanks to its advanced technology and industrial-grade design. Perfect for a wide range of applications, this versatile device is a game-changer in the world of embedded systems. Experience seamless connectivity and exceptional performance with the MSP430 family, setting new standards in efficiency and functionality. Elevate your projects with Texas Instruments and discover endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, making it suitable for a variety of applications.

Package Shape: SQUARE

Allows for efficient use of space on the circuit board.

No. of Terminals: 80

Provides ample connectivity options for various external components.

Minimum Supply Voltage: 2.4 V

Allows for operation with lower voltage inputs, increasing versatility.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

CPU Family: MSP430

Belongs to a well-known and reliable CPU family, ensuring high performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Includes additional circuitry for enhanced functionality and capabilities.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67641IPN attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

RAM Words:

8

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

MSP430F67641IPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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