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MSP430F67621IPZR

Texas Instruments

MSP430F67621IPZR by Texas Instruments

MSP430F67621IPZR by Texas Instruments is a 100-terminal microprocessor circuit with 4096 bytes of RAM. It operates b/w -40 to 85°C, compatible with I2C, SPI, and UART buses. Ideal for industrial applications requiring low-profile, fine-pitch packages in a compact square shape.

Median Price

$5.432

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,550 parts In-Stock

1+ parts

$5.432

100+ parts

$4.428

1k+ parts

$2.952

10k+ parts

-

2,550

$5.432

$4.428

$2.952

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,686 parts In-Stock

1+ parts

$5.160

100+ parts

-

1k+ parts

-

10k+ parts

-

4,686

$5.160

-

-

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Vyrian

USA . 8,943 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,943

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 446 parts In-Stock

1+ parts

$4.889

100+ parts

-

1k+ parts

-

10k+ parts

-

446

$4.889

-

-

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AZTECH Wire

Italy . 483 parts In-Stock

1+ parts

$9.240

100+ parts

-

1k+ parts

-

10k+ parts

-

483

$9.240

-

-

-

Parana Technologies

USA . 287 parts In-Stock

1+ parts

$13.679

100+ parts

-

1k+ parts

$14.179

10k+ parts

-

287

$13.679

-

$14.179

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DigiPath Technology Company

USA . 1,721 parts In-Stock

1+ parts

$15.063

100+ parts

-

1k+ parts

-

10k+ parts

-

1,721

$15.063

-

-

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ChromeModa Solutions

Germany . 1,239 parts In-Stock

1+ parts

$15.370

100+ parts

$12.603

1k+ parts

-

10k+ parts

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1,239

$15.370

$12.603

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IDEA Electronic Components Group

UK . 793 parts In-Stock

1+ parts

$15.370

100+ parts

$14.602

1k+ parts

$13.833

10k+ parts

-

793

$15.370

$14.602

$13.833

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Microchip USA

USA . 2,896 parts In-Stock

1+ parts

$26.160

100+ parts

$26.000

1k+ parts

$25.920

10k+ parts

$25.840

2,896

$26.160

$26.000

$25.920

$25.840

Corohmni

South Africa . 533 parts In-Stock

1+ parts

$85.995

100+ parts

-

1k+ parts

-

10k+ parts

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533

$85.995

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Overview

Unleash the power of innovation with the MSP430F67621IPZR by Texas Instruments, a cutting-edge microprocessor circuit designed to revolutionize your projects. Built with precision and quality in mind, this Industrial-grade device offers unmatched performance and reliability. Whether you're working on IoT applications, consumer electronics, or industrial automation, this versatile solution delivers the value, benefits, and advantages you need to take your designs to the next level. Say goodbye to limitations and hello to endless possibilities with the MSP430F67621IPZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for portable devices.

Surface Mount: YES

Ease of installation and space-saving design make it ideal for compact electronic devices.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of voltage inputs, increasing compatibility with various power sources.

Package Shape: SQUARE

Square shape allows for efficient use of space on a circuit board.

No. of Terminals: 100

Sufficient number of terminals for connecting to other components or peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style minimizes the overall height of the package, making it suitable for slim devices.

Minimum Supply Voltage: 2.4 V

Allows for operation even with lower voltage sources, increasing versatility.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

CPU Family: MSP430

The MSP430 family is known for low power consumption and high performance, making it a reliable choice.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of a microprocessor circuit expands the capabilities of the product for advanced functionality.

RAM Bytes: 4096

Ample memory capacity for storing and processing data efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the product.

Bus Compatibility: I2C; SPI; UART

Support for multiple bus protocols allows for easy communication with various external devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67621IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

RAM Words:

4

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67621IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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