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MSP430F67491AIPEUR

Texas Instruments

MSP430F67491AIPEUR by Texas Instruments

MSP430F67491AIPEUR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 32 RAM words. It features 6 ADC channels, 3 DMA channels, and peripherals like BOR, RTC, and timers. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$9.869

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 40,201 parts In-Stock

1+ parts

$9.869

100+ parts

$8.620

1k+ parts

$5.945

10k+ parts

-

40,201

$9.869

$8.620

$5.945

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 50 parts In-Stock

1+ parts

$9.376

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$9.376

-

-

-

Vyrian

USA . 5,764 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,764

-

-

-

-

Chip Stock

USA . 4,716 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,716

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 39,766 parts In-Stock

1+ parts

$8.390

100+ parts

$8.180

1k+ parts

$8.138

10k+ parts

-

39,766

$8.390

$8.180

$8.138

-

Corphita

USA . 4,593 parts In-Stock

1+ parts

$8.882

100+ parts

-

1k+ parts

-

10k+ parts

-

4,593

$8.882

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-

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AZTECH Wire

Italy . 1,124 parts In-Stock

1+ parts

$17.820

100+ parts

-

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-

10k+ parts

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1,124

$17.820

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-

-

Microchip USA

USA . 2,461 parts In-Stock

1+ parts

$28.157

100+ parts

-

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10k+ parts

-

2,461

$28.157

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-

-

Parana Technologies

USA . 2 parts In-Stock

1+ parts

$72.419

100+ parts

$6,725.230

1k+ parts

$65.177

10k+ parts

-

2

$72.419

$6,725.230

$65.177

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DigiPath Technology Company

USA . 2,127 parts In-Stock

1+ parts

$79.743

100+ parts

-

1k+ parts

-

10k+ parts

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2,127

$79.743

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-

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Corohmni

South Africa . 4,880 parts In-Stock

1+ parts

$81.022

100+ parts

-

1k+ parts

-

10k+ parts

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4,880

$81.022

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-

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ChromeModa Solutions

Germany . 2,254 parts In-Stock

1+ parts

$81.370

100+ parts

$66.723

1k+ parts

-

10k+ parts

-

2,254

$81.370

$66.723

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IDEA Electronic Components Group

UK . 2,064 parts In-Stock

1+ parts

$81.370

100+ parts

$77.302

1k+ parts

$73.233

10k+ parts

-

2,064

$81.370

$77.302

$73.233

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Overview

Discover the Texas Instruments MSP430F67491AIPEUR, a high-quality microprocessor circuit designed for a wide range of applications. With advanced technology and reliable performance, this product offers 6-channel 10-bit ADC, 32768 bytes of RAM, and flash ROM programmability. Ideal for industrial use, this versatile IC features connectivity options like I2C, SPI, and UART, along with built-in peripherals such as real-time clock and multiple timers. Unlock new possibilities for your projects with the MSP430F67491AIPEUR, delivering value, efficiency, and innovation to customers seeking top-notch functionality in a compact package.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring longevity and reliability.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of applications.

Bit Size: 16

Offers a good balance between processing power and energy efficiency, suitable for a variety of tasks.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Enables the integration of multiple peripherals and functions on a single chip, reducing component count and simplifying design.

Nominal Supply Voltage: 3.3 V

Standard voltage level for many electronic systems, providing compatibility and ease of integration.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Offers a variety of communication options, allowing for connectivity with a wide range of devices and systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67491AIPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67491AIPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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