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MSP430F6748AIPEUR

Texas Instruments

MSP430F6748AIPEUR by Texas Instruments

MSP430F6748AIPEUR by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at up to 0.032768 MHz. It features 6 ADC channels, 3 DMA channels, and peripherals like BOR and RTC. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$9.321

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,701 parts In-Stock

1+ parts

$9.321

100+ parts

$8.142

1k+ parts

$5.615

10k+ parts

-

1,701

$9.321

$8.142

$5.615

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 966 parts In-Stock

1+ parts

$8.855

100+ parts

-

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-

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966

$8.855

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Vyrian

USA . 4,734 parts In-Stock

1+ parts

-

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-

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4,734

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 650 parts In-Stock

1+ parts

$8.260

100+ parts

-

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-

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650

$8.260

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Corphita

USA . 2,037 parts In-Stock

1+ parts

$8.389

100+ parts

-

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2,037

$8.389

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Microchip USA

USA . 2,245 parts In-Stock

1+ parts

$23.020

100+ parts

$22.700

1k+ parts

$22.530

10k+ parts

$22.370

2,245

$23.020

$22.700

$22.530

$22.370

Parana Technologies

USA . 1,017 parts In-Stock

1+ parts

$50.163

100+ parts

-

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1,017

$50.163

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DigiPath Technology Company

USA . 940 parts In-Stock

1+ parts

$55.236

100+ parts

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940

$55.236

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ChromeModa Solutions

Germany . 1,287 parts In-Stock

1+ parts

$56.363

100+ parts

$46.218

1k+ parts

-

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1,287

$56.363

$46.218

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IDEA Electronic Components Group

UK . 790 parts In-Stock

1+ parts

$56.363

100+ parts

$53.545

1k+ parts

$50.727

10k+ parts

-

790

$56.363

$53.545

$50.727

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Corohmni

South Africa . 1,857 parts In-Stock

1+ parts

$79.701

100+ parts

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1,857

$79.701

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Overview

Unlock the power of cutting-edge technology with the MSP430F6748AIPEUR by Texas Instruments. This innovative microprocessor circuit offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this product provides customers with unmatched value and benefits, including advanced peripherals like BOR, RTC, and DMA. Say goodbye to limitations and hello to endless possibilities with the MSP430F6748AIPEUR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources.

Bit Size: 16

Enables processing of complex data and tasks efficiently.

ADC Channels: YES

Allows for analog to digital conversion, enhancing the device's functionality.

ROM Words: 524288

Provides ample storage capacity for program instructions and data.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Ensures efficient integration of peripheral functions with the main microprocessor.

Nominal Supply Voltage: 3.3 V

Optimal voltage level for stable and reliable operation of the product.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Offers multiple communication options for seamless interaction with external devices.

Speed: 25 rpm

Provides fast processing capabilities for time-sensitive applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6748AIPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6748AIPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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