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MSP430F67481IPZR

Texas Instruments

MSP430F67481IPZR by Texas Instruments

MSP430F67481IPZR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it has a supply voltage range of 1.8-3.6 V, making it ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,351 parts In-Stock

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Digiode

USA . 3,726 parts In-Stock

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3,726

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Distributors (Availability)

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AZTECH Wire

Italy . 587 parts In-Stock

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$11.493

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587

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One Stop Electronics

USA . 224 parts In-Stock

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$24.000

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Corohmni

South Africa . 5,213 parts In-Stock

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$49.499

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Parana Technologies

USA . 1,299 parts In-Stock

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$49.624

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$4,608.316

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$44.661

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DigiPath Technology Company

USA . 1,790 parts In-Stock

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$54.642

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$50.271

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ChromeModa Solutions

Germany . 4,768 parts In-Stock

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$55.757

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$45.721

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IDEA Electronic Components Group

UK . 156 parts In-Stock

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$55.757

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$52.969

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$50.181

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Component Stockers USA

USA . 708 parts In-Stock

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$99.990

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Corphita

USA . 1,042 parts In-Stock

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Microchip USA

USA . 498 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the MSP430F67481IPZR, a cutting-edge MICROPROCESSOR CIRCUIT that offers exceptional performance in a compact SQUARE package. Ideal for applications requiring low power consumption and high efficiency, this 16-bit processor boasts a FLASH ROM programmability of 524288 words and 16384 bytes of RAM. With a wide operating temperature range and a maximum supply voltage of 3.6V, this Industrial-grade device is perfect for industrial automation, consumer electronics, and more. Trust Texas Instruments to deliver advanced technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the IC, ensuring a longer lifespan for the product.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for compatibility with a wider range of power sources, increasing flexibility in design.

Package Shape: SQUARE

Square package shape is space-efficient and easy to integrate into compact electronic devices.

Bit Size: 16

16-bit processing capability enables efficient and reliable performance for various applications.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages offers versatility in powering the IC, making it suitable for a variety of setups.

No. of Terminals: 100

Having a high number of terminals allows for a greater degree of connectivity and functionality in the product.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures a compact design and reliable connection with other components on the PCB.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage requirement helps in reducing power consumption and increasing efficiency of the product.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range allows for reliable performance in various environmental conditions.

CPU Family: MSP430

Belonging to the MSP430 CPU family indicates high-quality and reliable performance for the IC.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range ensures operation in extreme cold conditions without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers a reliable and durable connection, reducing the risk of corrosion and ensuring long-term functionality.

Terminal Position: QUAD

Quad-terminal position allows for easy and efficient soldering onto the PCB, simplifying the manufacturing process.

ROM Words: 524288

Large ROM capacity of 524288 words provides ample storage for programs and data, enhancing the versatility of the product.

Maximum Seated Height: 1.6 mm

Low maximum seated height enables a slim profile for the product, making it suitable for compact electronic devices.

Width: 14 mm

Compact width dimension makes the IC suitable for smaller PCB designs and space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand up to 30 seconds at peak reflow temperature, ensuring integrity during the manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for reliable soldering during the manufacturing process.

Length: 14 mm

Compact length dimension makes the IC suitable for smaller PCB designs and space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability and performance in harsh operating conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit type indicates advanced processing capabilities, making it suitable for complex applications.

RAM Bytes: 16384

With 16384 bytes of RAM, the IC can handle and process large amounts of data efficiently and effectively.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the product.

Terminal Form: GULL WING

Gull wing terminal form offers a secure and reliable connection, ensuring proper functionality and longevity of the product.

Maximum Supply Current: 11.75 mA

Low maximum supply current helps in reducing power consumption and heat dissipation, improving overall efficiency.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable performance of the IC.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to firmware, enhancing the flexibility and adaptability of the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables precise soldering and compact layout design on the PCB, enhancing overall product quality.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to maintain performance.

Speed: 25 rpm

Operating at a speed of 25 rpm, the IC can process data and execute instructions efficiently, meeting the performance requirements of various applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67481IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

CPU Family:

MSP430

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67481IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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