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MSP430F6747IPZR

Texas Instruments

MSP430F6747IPZR by Texas Instruments

MSP430F6747IPZR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. Operating at a max frequency of 25 MHz, it is ideal for industrial applications requiring low power consumption and high performance. With ADC channels, I2C/SPI/UART compatibility, and a compact square package design, this microprocessor offers versatile solutions for various embedded systems.

Median Price

$6.716

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 91,072 parts In-Stock

1+ parts

$6.716

100+ parts

$5.475

1k+ parts

$3.650

10k+ parts

-

91,072

$6.716

$5.475

$3.650

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,929 parts In-Stock

1+ parts

$6.380

100+ parts

-

1k+ parts

-

10k+ parts

-

3,929

$6.380

-

-

-

Vyrian

USA . 8,713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,713

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 235 parts In-Stock

1+ parts

$5.313

100+ parts

-

1k+ parts

-

10k+ parts

-

235

$5.313

-

-

-

Corphita

USA . 4,120 parts In-Stock

1+ parts

$6.044

100+ parts

-

1k+ parts

-

10k+ parts

-

4,120

$6.044

-

-

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AZTECH Wire

Italy . 981 parts In-Stock

1+ parts

$16.200

100+ parts

-

1k+ parts

-

10k+ parts

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981

$16.200

-

-

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Parana Technologies

USA . 1,040 parts In-Stock

1+ parts

$28.439

100+ parts

-

1k+ parts

$47.477

10k+ parts

-

1,040

$28.439

-

$47.477

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DigiPath Technology Company

USA . 256 parts In-Stock

1+ parts

$31.315

100+ parts

-

1k+ parts

-

10k+ parts

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256

$31.315

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-

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ChromeModa Solutions

Germany . 1,337 parts In-Stock

1+ parts

$31.954

100+ parts

$26.202

1k+ parts

-

10k+ parts

-

1,337

$31.954

$26.202

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-

IDEA Electronic Components Group

UK . 178 parts In-Stock

1+ parts

$31.954

100+ parts

$30.356

1k+ parts

$28.759

10k+ parts

-

178

$31.954

$30.356

$28.759

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Microchip USA

USA . 1,501 parts In-Stock

1+ parts

$32.350

100+ parts

$32.150

1k+ parts

$32.050

10k+ parts

$31.950

1,501

$32.350

$32.150

$32.050

$31.950

Overview

Unlock the power of innovation with the Texas Instruments MSP430F6747IPZR, a cutting-edge microprocessor circuit that offers unmatched performance and reliability. With a maximum clock frequency of 25 MHz and ROM programmability, this device is perfect for a wide range of applications. Whether you're designing IoT devices, automotive systems, or industrial controls, the MSP430F6747IPZR delivers exceptional quality and efficiency. Trust in Texas Instruments' legacy of excellence and elevate your projects to new heights with this versatile and powerful solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the product, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Ideal for applications that require higher voltage levels.

Package Shape: SQUARE

Efficient use of space on the circuit board.

Bit Size: 16

Provides sufficient processing power for a variety of tasks.

Power Supplies (V): 2/3.3

Offers flexibility in power options for different applications.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enhances the overall compactness and efficiency of the product.

Minimum Supply Voltage: 1.8 V

Allows for operation in low-power environments.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where higher temperatures may be encountered.

CPU Family: MSP430

Known for its low power consumption and high performance, making it an efficient choice for various applications.

Minimum Operating Temperature: -40 °C

Can withstand extremely cold temperatures, ideal for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Allows for analog to digital conversion, essential for many applications.

Terminal Position: QUAD

Facilitates easy soldering and connection to the circuit board.

ROM Words: 262144

Offers ample storage capacity for program data.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

RAM Words: 32

Provides temporary storage for quick access data.

Width: 14 mm

Compact size for efficient use of space on the circuit board.

Maximum Clock Frequency: 25 MHz

Suitable for handling high-speed processing tasks efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

Withstands high temperatures during soldering without damage.

Length: 14 mm

Compact size for efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

Suitable for rugged industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Essential for controlling and managing various functions in electronic devices.

RAM Bytes: 32768

Ample memory for storing data during operation.

Technology: CMOS

Known for low power consumption and high noise immunity.

Terminal Form: GULL WING

Facilitates easy soldering and connection to the circuit board.

Maximum Supply Current: 11.75 mA

Efficient power consumption for energy-saving operation.

Nominal Supply Voltage: 3.3 V

Stable voltage supply for reliable operation.

ROM Programmability: FLASH

Allows for easy reprogramming of the ROM for updates and customization.

Bus Compatibility: I2C; SPI; UART

Supports various communication protocols for versatile connectivity.

Terminal Pitch: 0.5 mm

Allows for compact spacing of terminals for efficient design.

Moisture Sensitivity Level (MSL): 3

Can withstand moderate exposure to moisture during handling and storage.

Speed: 25 rpm

Suitable for processing tasks at a moderate speed.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6747IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6747IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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