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MSP430F6747AIPEU

Texas Instruments

MSP430F6747AIPEU by Texas Instruments

MSP430F6747AIPEU by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. It features 6-Ch 10-Bit ADC channels, PWM support, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$11.882

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 254 parts In-Stock

1+ parts

$9.925

100+ parts

$8.091

1k+ parts

$5.394

10k+ parts

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254

$9.925

$8.091

$5.394

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Mouser Electronics

USA . 14 parts In-Stock

1+ parts

$13.840

100+ parts

$7.920

1k+ parts

$7.850

10k+ parts

$7.550

14

$13.840

$7.920

$7.850

$7.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 95 parts In-Stock

1+ parts

$9.429

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95

$9.429

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Bristol Electronics

USA . 144 parts In-Stock

1+ parts

$10.074

100+ parts

$7.051

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144

$10.074

$7.051

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Vyrian

USA . 3,206 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 144 parts In-Stock

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Dan-Mar Components

USA . 144 parts In-Stock

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144

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Semi Source

USA . 71 parts In-Stock

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71

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,466 parts In-Stock

1+ parts

$8.932

100+ parts

-

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2,466

$8.932

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Corohmni

South Africa . 140 parts In-Stock

1+ parts

$10.677

100+ parts

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140

$10.677

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Microchip USA

USA . 2,459 parts In-Stock

1+ parts

$32.030

100+ parts

$31.570

1k+ parts

$31.350

10k+ parts

$31.120

2,459

$32.030

$31.570

$31.350

$31.120

Parana Technologies

USA . 1,588 parts In-Stock

1+ parts

$66.581

100+ parts

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1,588

$66.581

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DigiPath Technology Company

USA . 2,159 parts In-Stock

1+ parts

$73.314

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2,159

$73.314

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ChromeModa Solutions

Germany . 4,114 parts In-Stock

1+ parts

$74.810

100+ parts

$61.344

1k+ parts

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4,114

$74.810

$61.344

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IDEA Electronic Components Group

UK . 1,307 parts In-Stock

1+ parts

$74.810

100+ parts

$71.070

1k+ parts

$67.329

10k+ parts

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1,307

$74.810

$71.070

$67.329

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 81 parts In-Stock

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81

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F6747AIPEU microprocessor circuit. Experience unparalleled quality and reliability from a trusted manufacturer, offering a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category. With advanced features like ADC channels, DMA channels, and PWM channels, this industrial-grade processor delivers exceptional performance and efficiency. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations, making your projects seamless and successful. Elevate your designs with the MSP430F6747AIPEU and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options.

CPU Family: MSP430

Belonging to the MSP430 CPU family ensures compatibility with existing systems and familiarity for developers.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit enables the product to efficiently handle various peripherals and interfaces.

ADC Channels: YES

Having analog to digital converters built-in allows for easy interfacing with analog sensors and signals.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Multiple connectivity options such as I2C, IRDA, SPI, and UART make the product versatile for communication with other devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6747AIPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6747AIPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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