Loading...

MSP430F67461IPZ

Texas Instruments

MSP430F67461IPZ by Texas Instruments

MSP430F67461IPZ by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it supports I2C, SPI, UART buses for industrial applications requiring low power consumption. The package style is flatpack with a low profile and fine pitch design.

Median Price

$7.619

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 740 parts In-Stock

1+ parts

$7.619

100+ parts

$6.212

1k+ parts

$4.141

10k+ parts

-

740

$7.619

$6.212

$4.141

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,065 parts In-Stock

1+ parts

$7.238

100+ parts

-

1k+ parts

-

10k+ parts

-

4,065

$7.238

-

-

-

Vyrian

USA . 5,914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,914

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,735 parts In-Stock

1+ parts

$6.857

100+ parts

-

1k+ parts

-

10k+ parts

-

1,735

$6.857

-

-

-

Corohmni

South Africa . 2,666 parts In-Stock

1+ parts

$10.400

100+ parts

-

1k+ parts

-

10k+ parts

-

2,666

$10.400

-

-

-

AZTECH Wire

Italy . 813 parts In-Stock

1+ parts

$13.650

100+ parts

-

1k+ parts

-

10k+ parts

-

813

$13.650

-

-

-

Microchip USA

USA . 2,961 parts In-Stock

1+ parts

$20.850

100+ parts

$20.550

1k+ parts

$20.400

10k+ parts

$20.250

2,961

$20.850

$20.550

$20.400

$20.250

Parana Technologies

USA . 49 parts In-Stock

1+ parts

$76.815

100+ parts

-

1k+ parts

-

10k+ parts

-

49

$76.815

-

-

-

DigiPath Technology Company

USA . 1,626 parts In-Stock

1+ parts

$84.583

100+ parts

-

1k+ parts

-

10k+ parts

-

1,626

$84.583

-

-

-

ChromeModa Solutions

Germany . 3,573 parts In-Stock

1+ parts

$86.309

100+ parts

$70.773

1k+ parts

-

10k+ parts

-

3,573

$86.309

$70.773

-

-

IDEA Electronic Components Group

UK . 980 parts In-Stock

1+ parts

$86.309

100+ parts

$81.994

1k+ parts

$77.678

10k+ parts

-

980

$86.309

$81.994

$77.678

-

Component Stockers USA

USA . 804 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

804

-

-

-

-

Overview

Unlock the power of innovation with the Texas Instruments MSP430F67461IPZ microprocessor circuit. This high-quality product offers customers a reliable solution for a wide range of applications, from IoT devices to industrial automation. With its advanced technology and superior performance, this MSP430 CPU family member provides unmatched value and benefits. Trust in Texas Instruments' reputation for excellence and elevate your projects with the MSP430F67461IPZ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB design, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can be used in a wide range of applications without risk of damage.

Package Shape: SQUARE

The square shape of the package allows for easier integration into circuit designs and board layouts.

Bit Size: 16

The 16-bit architecture offers higher computational power and precision compared to lower bit sizes.

Power Supplies (V): 2/3.3

The dual power supply options allow for flexibility in voltage selection based on the specific requirements of the application.

No. of Terminals: 100

A higher number of terminals provide more connection options and versatility in circuit configurations.

ADC Channels: YES

The presence of analog-to-digital converter channels enables the device to interface with various sensors and analog signals for data acquisition.

ROM Words: 262144

The large ROM capacity allows for storing a significant amount of program data and instructions for the processor to execute.

RAM Words: 16

While relatively small, the RAM capacity is sufficient for storing temporary data and variables during program execution.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can operate reliably in harsh environmental conditions with wide temperature ranges.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

This product includes built-in peripheral circuits for enhanced functionality and connectivity options with external devices.

ROM Programmability: FLASH

The flash ROM technology allows for easy reprogramming of the memory content, enabling firmware updates and modifications.

Bus Compatibility: I2C; SPI; UART

Support for multiple bus protocols enables seamless communication with external devices and peripherals in various configurations.

Speed: 25 rpm

The processing speed of 25 rpm ensures efficient execution of instructions and tasks, making the product suitable for real-time applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67461IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67461IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20