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MSP430F67451AIPZR

Texas Instruments

MSP430F67451AIPZR by Texas Instruments

MSP430F67451AIPZR by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM channels, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$5.763

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,950 parts In-Stock

1+ parts

$5.763

100+ parts

$4.698

1k+ parts

$3.132

10k+ parts

-

2,950

$5.763

$4.698

$3.132

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,852 parts In-Stock

1+ parts

$5.475

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-

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2,852

$5.475

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Vyrian

USA . 7,644 parts In-Stock

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7,644

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 757 parts In-Stock

1+ parts

$5.187

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-

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757

$5.187

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AZTECH Wire

Italy . 285 parts In-Stock

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$9.290

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285

$9.290

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Microchip USA

USA . 2,043 parts In-Stock

1+ parts

$27.760

100+ parts

$27.590

1k+ parts

$27.500

10k+ parts

$27.420

2,043

$27.760

$27.590

$27.500

$27.420

Parana Technologies

USA . 821 parts In-Stock

1+ parts

$56.824

100+ parts

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821

$56.824

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ChromeModa Solutions

Germany . 854 parts In-Stock

1+ parts

$63.847

100+ parts

$52.355

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854

$63.847

$52.355

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IDEA Electronic Components Group

UK . 343 parts In-Stock

1+ parts

$63.847

100+ parts

$60.655

1k+ parts

$57.462

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343

$63.847

$60.655

$57.462

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Corohmni

South Africa . 856 parts In-Stock

1+ parts

$85.990

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856

$85.990

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DigiPath Technology Company

USA . 1,801 parts In-Stock

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$57.564

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1,801

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$57.564

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F67451AIPZR microprocessor circuit. This cutting-edge technology offers unparalleled quality and reliability, backed by the trusted name of Texas Instruments. With a wide range of applications in mind, this versatile product delivers exceptional value to customers looking for efficient performance and seamless connectivity. Experience the advantages of the MSP430 family and take your projects to the next level with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the integrated circuits inside, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power supply options, accommodating a wide range of applications.

Bit Size: 16

16-bit processing allows for higher precision and efficiency in data handling and calculations.

ADC Channels: YES

Built-in Analog to Digital Converters enable the device to accurately measure and convert analog signals to digital data, expanding its functionality.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Having a microprocessor circuit as a peripheral IC enhances the processing power and capabilities of the device, making it suitable for complex tasks.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the product.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Multiple connectivity options such as I2C, IRDA, SPI, and UART provide versatile communication interfaces for connecting with other devices or systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67451AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67451AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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