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MSC1214Y4PAGR

Texas Instruments

MSC1214Y4PAGR by Texas Instruments

The Texas Instruments MSC1214Y4PAGR microcontroller features an 8-bit CPU with 16-bit address bus, operating at up to 40 MHz. With DAC and ADC channels, it is ideal for automotive applications requiring a wide temperature range (-40 to 125 °C) and low power consumption (3/5 V).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,536 parts In-Stock

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Digiode

USA . 699 parts In-Stock

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699

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AZTECH Wire

Italy . 643 parts In-Stock

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$11.121

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One Stop Electronics

USA . 156 parts In-Stock

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$34.000

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Parana Technologies

USA . 2,182 parts In-Stock

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$36.455

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DigiPath Technology Company

USA . 1,084 parts In-Stock

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$40.142

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$36.930

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$36.930

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ChromeModa Solutions

Germany . 5,246 parts In-Stock

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$40.961

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$33.588

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IDEA Electronic Components Group

UK . 1,959 parts In-Stock

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$40.961

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$38.913

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$36.865

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A-Z Elektronik GmbH

Germany . 5,622 parts In-Stock

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Corphita

USA . 4,322 parts In-Stock

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Microchip USA

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Overview

Unlock limitless possibilities with the Texas Instruments MSC1214Y4PAGR microcontroller. This high-quality device offers superior performance and reliability, thanks to its leading manufacturer. Ideal for a wide range of applications, this microcontroller provides unmatched value with its advanced features and capabilities. Experience seamless functionality and efficiency with this innovative product, designed to meet all your needs and exceed your expectations. Elevate your projects with the Texas Instruments MSC1214Y4PAGR microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology makes the product easy to integrate onto PCBs, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage allows for flexibility in powering the microcontroller and supporting a wider range of applications.

Address Bus Width: 16

Wider address bus width allows for accessing a larger memory space and handling more complex tasks.

Bit Size: 8

The 8-bit architecture provides a good balance between performance and cost, suitable for a variety of applications.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog sensors or devices, expanding its capabilities.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies allows compatibility with a wide range of external components and systems.

No. of Terminals: 64

Having a larger number of terminals provides more connectivity options and flexibility in designing the circuit layout.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to easily read analog sensor data, making it suitable for sensor-based applications.

ROM Words: 16384

With a large ROM capacity, the microcontroller can store a significant amount of program instructions, allowing for complex functionality.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes the microcontroller suitable for applications in harsh environments where temperatures can reach high levels.

Technical Specifications

Microcontrollers MSC1214Y4PAGR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1280

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSC1214Y4PAGR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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