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MSC1213Y3PAGR

Texas Instruments

MSC1213Y3PAGR by Texas Instruments

The Texas Instruments MSC1213Y3PAGR is an 8051 microcontroller with 8-bit CPU, 16-bit address bus, and 8-bit external data bus. It features DAC and ADC channels, operates at up to 40 MHz, and has a temperature range of -40 to 125 °C. Ideal for automotive applications requiring a compact microcontroller with PWM capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,079 parts In-Stock

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Digiode

USA . 1,109 parts In-Stock

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1,109

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Distributors (Availability)

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One Stop Electronics

USA . 1,393 parts In-Stock

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$10.000

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$10.000

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AZTECH Wire

Italy . 547 parts In-Stock

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$13.912

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547

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Parana Technologies

USA . 2,065 parts In-Stock

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$29.456

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$59.566

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2,065

$29.456

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$59.566

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ChromeModa Solutions

Germany . 6,625 parts In-Stock

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$33.097

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$27.140

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6,625

$33.097

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IDEA Electronic Components Group

UK . 31 parts In-Stock

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$33.097

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$31.442

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$29.787

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31

$33.097

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$29.787

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Corphita

USA . 1,156 parts In-Stock

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Microchip USA

USA . 380 parts In-Stock

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DigiPath Technology Company

USA . 332 parts In-Stock

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$29.840

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$29.840

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Overview

Elevate your projects with the MSC1213Y3PAGR by Texas Instruments, a top-of-the-line microcontroller that promises unparalleled quality and reliability. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology to meet all your needs. Ideal for a wide range of applications, this microcontroller offers exceptional value and benefits to customers looking to optimize their systems. Experience the advantages of advanced features and functionalities without compromising on performance. Choose Texas Instruments for superior solutions that set you apart from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient PCB mounting, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 5.25 V

Provides a wider operating voltage range, accommodating various power supply options.

Address Bus Width: 16

Allows for efficient memory addressing and data transfer capabilities.

Bit Size: 8

Suitable for handling smaller data sizes efficiently in embedded applications.

DAC Channels: YES

Enables analog output capabilities, expanding the range of applications the microcontroller can be used for.

Power Supplies (V): 3/5

Supports multiple power supply options, providing flexibility in design and implementation.

No. of Terminals: 64

Offers a sufficient number of I/O connections for interfacing with external devices and peripherals.

Minimum Supply Voltage: 4.75 V

Ensures reliable operation even at lower voltage levels, enhancing the product's stability.

Maximum Operating Temperature: 125 °C

Allows for operation in high-temperature environments, making it suitable for industrial or automotive applications.

CPU Family: 8051

Part of a well-established and widely used microcontroller family, ensuring compatibility and support.

ADC Channels: YES

Enables analog input capabilities, essential for reading and processing real-world signals.

ROM Words: 8192

Offers ample non-volatile memory for program storage, allowing for complex functionalities and applications.

Peripheral IC Type: MICROCONTROLLER

Integrates various peripherals on a single chip, reducing external component count and simplifying system design.

RAM Bytes: 1280

Provides sufficient random-access memory for data storage and manipulation during program execution.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, improving overall efficiency.

PWM Channels: YES

Supports pulse-width modulation outputs for precise control over analog signals, expanding application possibilities.

ROM Programmability: FLASH

Features reprogrammable flash memory, allowing for easy updates and modifications to the program code.

Speed: 40 rpm

Operates at a clock frequency of 40 MHz, providing sufficient processing power for various tasks and applications.

Technical Specifications

Microcontrollers MSC1213Y3PAGR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1280

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSC1213Y3PAGR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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