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MSC1211Y4PAGTG4

Texas Instruments

MSC1211Y4PAGTG4 by Texas Instruments

Texas Instruments' MSC1211Y4PAGTG4 microcontroller features 16-bit DAC, 8-bit CPU, and 64K data EEPROM. Ideal for automotive applications with 40 MHz clock frequency, it offers connectivity via I2C, SPI, USART interfaces. Operating b/w -40 to 125 °C, this CMOS device supports low power mode and includes BOR, PWM, TIMER(4), WDT peripherals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,630 parts In-Stock

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5,630

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Digiode

USA . 3,529 parts In-Stock

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3,529

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Distributors (Availability)

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AZTECH Wire

Italy . 830 parts In-Stock

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$7.681

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830

$7.681

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One Stop Electronics

USA . 1,524 parts In-Stock

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$9.000

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1,524

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Parana Technologies

USA . 1,832 parts In-Stock

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$26.945

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$30.381

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1,832

$26.945

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$30.381

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DigiPath Technology Company

USA . 366 parts In-Stock

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$29.670

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$27.296

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366

$29.670

$27.296

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ChromeModa Solutions

Germany . 2,215 parts In-Stock

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$30.275

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$24.826

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2,215

$30.275

$24.826

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IDEA Electronic Components Group

UK . 241 parts In-Stock

1+ parts

$30.275

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$28.761

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$27.248

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241

$30.275

$28.761

$27.248

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QUARKTWIN TECHNOLOGY LTD

USA . 13,797 parts In-Stock

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Microchip USA

USA . 3,427 parts In-Stock

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Corphita

USA . 1,539 parts In-Stock

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Overview

Unleash innovation with the MSC1211Y4PAGTG4 by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers top-notch quality and reliability. This versatile microcontroller is perfect for a wide range of applications, offering unparalleled value to customers. With features like DAC channels, ADC channels, and peripherals like BOR and PWM, this product provides endless possibilities for creativity and functionality. Elevate your projects with the Texas Instruments MSC1211Y4PAGTG4 and experience the power of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product suitable for various applications.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power input, making the product reliable in different operating conditions.

Address Bus Width: 16

A wide address bus width of 16 allows for efficient memory addressing, enhancing the processing capabilities of the microcontroller.

Bit Size: 8

With a bit size of 8, the microcontroller can efficiently handle data processing and manipulation tasks.

DAC Channels: YES

Having Digital-To-Analog Converter (DAC) channels enables the microcontroller to interface with analog components, expanding its functionality.

No. of Terminals: 64

A high number of terminals provide ample connectivity options, allowing the microcontroller to interact with a wide range of external devices.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures that the microcontroller can operate efficiently even in low-power situations.

CPU Family: 8051

The 8051 CPU family is known for its reliability and versatility, making it a popular choice for embedded systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the microcontroller can withstand elevated temperatures, making it suitable for industrial and automotive applications.

ADC Channels: YES

Having Analog-To-Digital Converter (ADC) channels allows the microcontroller to convert external analog signals into digital data for processing.

Technical Specifications

Microcontrollers MSC1211Y4PAGTG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

8

Boundary Scan:

NO

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

0

No. of I/O Lines:

32

No. of Serial I/Os:

13

No. of Terminals:

64

No. of Timers:

4

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1280

RAM Words:

160

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

"I2C, SPI, USART"

Peripherals:

"BOR, PWM, TIMER(4), WDT"

Analog To Digital Convertors:

8-Ch 24-Bit

Digital To Analog Convertors:

4-Ch 16-Bit

Trade Compliance

MSC1211Y4PAGTG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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