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MSC1210Y3PAGR

Texas Instruments

MSC1210Y3PAGR by Texas Instruments

The Texas Instruments MSC1210Y3PAGR microcontroller features 8-bit data RAM, 16-bit address bus, and 8-channel ADC. Ideal for automotive applications with a temperature range of -40 to 125°C, it offers low power mode and connectivity via SPI and USART interfaces.

Median Price

$32.470

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 33,915 parts In-Stock

1+ parts

$21.731

100+ parts

$18.982

1k+ parts

$13.091

10k+ parts

-

33,915

$21.731

$18.982

$13.091

-

Rochester

USA . 12,136 parts In-Stock

1+ parts

-

100+ parts

$32.470

1k+ parts

$29.050

10k+ parts

$27.340

12,136

-

$32.470

$29.050

$27.340

DigiKey

USA . 12,136 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,136

-

-

-

-

Verical

USA . 12,136 parts In-Stock

1+ parts

-

100+ parts

$40.587

1k+ parts

$36.313

10k+ parts

$34.175

12,136

-

$40.587

$36.313

$34.175

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,904 parts In-Stock

1+ parts

$17.271

100+ parts

-

1k+ parts

-

10k+ parts

-

3,904

$17.271

-

-

-

Vyrian

USA . 7,224 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,224

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,344 parts In-Stock

1+ parts

$16.362

100+ parts

-

1k+ parts

-

10k+ parts

-

3,344

$16.362

-

-

-

Parana Technologies

USA . 2,027 parts In-Stock

1+ parts

$52.311

100+ parts

-

1k+ parts

-

10k+ parts

-

2,027

$52.311

-

-

-

DigiPath Technology Company

USA . 987 parts In-Stock

1+ parts

$57.600

100+ parts

$52.992

1k+ parts

-

10k+ parts

-

987

$57.600

$52.992

-

-

ChromeModa Solutions

Germany . 3,865 parts In-Stock

1+ parts

$58.776

100+ parts

$48.196

1k+ parts

-

10k+ parts

-

3,865

$58.776

$48.196

-

-

IDEA Electronic Components Group

UK . 2,030 parts In-Stock

1+ parts

$58.776

100+ parts

$55.837

1k+ parts

$52.898

10k+ parts

-

2,030

$58.776

$55.837

$52.898

-

A-Z Elektronik GmbH

Germany . 7,334 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,334

-

-

-

-

Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,000

-

-

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Perfect Parts

USA . 874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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874

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Overview

Discover the cutting-edge technology of the MSC1210Y3PAGR microcontroller by Texas Instruments, a leading manufacturer in the industry. This versatile product offers a wide range of applications, from automotive to industrial settings. With its high-quality construction and advanced features, this microcontroller provides unmatched value to customers. Experience enhanced performance, reliability, and efficiency with the MSC1210Y3PAGR, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a wide range of applications.

Surface Mount: YES

Facilitates easy and efficient PCB assembly, saving time and cost during manufacturing.

Maximum Supply Voltage: 5.25 V

Allows for a higher supply voltage range, providing flexibility in power supply design.

On Chip Data RAM Width: 8

Wide RAM width enables efficient data processing and storage capabilities.

Address Bus Width: 16

A wider address bus allows access to a larger memory space, enhancing the microcontroller's processing capabilities.

Package Shape: SQUARE

Square shape provides efficient use of PCB space and better alignment during assembly.

Bit Size: 8

8-bit architecture offers compatibility with a wide range of software and peripherals.

DAC Channels: YES

Inclusion of DAC channels allows for analog signal generation, expanding the microcontroller's functionality.

No. of Terminals: 64

Sufficient terminals for interfacing with external components and peripherals, enhancing the microcontroller's versatility.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Compact package style enables space-saving design and efficient heat dissipation.

Minimum Supply Voltage: 4.75 V

Wide voltage range ensures stable operation even under varying supply conditions.

Maximum Operating Temperature: 125 °C

High operating temperature range makes the microcontroller suitable for demanding industrial and automotive applications.

CPU Family: 8051

Membership in the proven 8051 CPU family ensures compatibility with existing software and development tools.

No. of External Interrupts: 4

Multiple external interrupts allow for real-time response to external events, enhancing system responsiveness.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables reliable operation in harsh environments and extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures reliable electrical connections and resistance to corrosion.

ADC Channels: YES

Inclusion of ADC channels allows for analog signal acquisition, enabling sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad terminal positioning facilitates efficient PCB layout and soldering during assembly.

ROM Words: 32768

Large ROM word capacity enables storage of program instructions and data, supporting complex applications.

Maximum Seated Height: 1.2 mm

Low profile design saves space on the PCB and allows for compact product form factor.

Width: 10 mm

Narrow width allows for efficient use of PCB space and compact system designs.

Data EEPROM Size: 64K

Large EEPROM size provides non-volatile data storage for critical system parameters and calibration values.

External Data Bus Width: 8

Matching external data bus width ensures efficient data transfer between the microcontroller and external memory or peripherals.

Peripherals: "BOR, PWM, TIMER(4), WDT

Inclusion of various peripherals enhances the microcontroller's functionality and versatility for different applications.

Maximum Clock Frequency: 33 MHz

High clock frequency allows for fast execution of instructions, enabling quick system response and processing.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient reflow time at peak temperature ensures proper soldering and reliable connections during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability supports lead-free soldering processes and reliable solder joints.

Length: 10 mm

Compact length allows for space-efficient PCB layout and system integration.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliable operation in automotive applications with stringent temperature requirements.

Peripheral IC Type: MICROCONTROLLER

Dedicated microcontroller IC type provides integrated processing and peripheral capabilities for system control and management.

No. of Timers: 4

Multiple timers support various timing functions and tasks, enhancing system functionality and control.

RAM Bytes: 1280

Large RAM capacity allows for data storage and manipulation, supporting data-intensive applications and multitasking.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing energy efficiency and system reliability.

Terminal Form: GULL WING

Gull wing terminal form enables easy surface mounting and reliable solder connections during assembly.

Analog To Digital Convertors: 8-Ch 24-Bit

Multiple ADC channels with high resolution enable accurate and precise analog signal conversion for sensor interfacing and data acquisition.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage simplifies power supply design and compatibility with existing systems and components.

PWM Channels: YES

Inclusion of PWM channels allows for precise control of motor speed, light intensity, and other analog outputs.

Connectivity: "SPI, USART(2)

Multiple connectivity options enable communication with external devices, sensors, and networks, expanding system integration capabilities.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and customization of program code, supporting flexible system development.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates high-density PCB layout and miniaturization of electronic products.

Format: FIXED POINT

Fixed-point format simplifies numerical computations and precision control in embedded systems and signal processing applications.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates suitable moisture resistance for reliable operation in various environmental conditions.

Speed: 33 rpm

High clock speed supports fast data processing and real-time control, enhancing system performance and responsiveness.

Low Power Mode: YES

Inclusion of low power modes enables energy-efficient operation and extended battery life for portable and battery-powered devices.

On Chip Program ROM Width: 8

Wide on-chip ROM width allows for storage of program instructions and data, supporting diverse applications and algorithms.

No. of I/O Lines: 32

Sufficient I/O lines for interfacing with external devices and peripherals, enabling versatile system control and communication.

Technical Specifications

Microcontrollers MSC1210Y3PAGR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY

Address Bus Width:

16

Bit Size:

8

Boundary Scan:

NO

CPU Family:

8051

Maximum Clock Frequency:

33 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

0

No. of External Interrupts:

4

No. of I/O Lines:

32

No. of Serial I/Os:

0

No. of Terminals:

64

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5,5

Qualification:

Not Qualified

RAM Bytes:

1280

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

"SPI, USART(2)"

Peripherals:

"BOR, PWM, TIMER(4), WDT"

Analog To Digital Convertors:

8-Ch 24-Bit

Trade Compliance

MSC1210Y3PAGR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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