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LM4F232H5BBFIGR

Texas Instruments

LM4F232H5BBFIGR by Texas Instruments

Texas Instruments' LM4F232H5BBFIGR is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. Featuring CORTEX-M4F CPU family, it operates b/w -40 to 85°C for industrial applications. With a speed of 80 rpm, this CMOS technology-based microcontroller is ideal for various embedded systems requiring high processing power in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,986 parts In-Stock

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Digiode

USA . 1,963 parts In-Stock

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1,963

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AZTECH Wire

Italy . 768 parts In-Stock

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$16.818

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One Stop Electronics

USA . 1,121 parts In-Stock

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$23.000

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Parana Technologies

USA . 2,127 parts In-Stock

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$30.340

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$69.018

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$30.340

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$69.018

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DigiPath Technology Company

USA . 390 parts In-Stock

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$33.408

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390

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ChromeModa Solutions

Germany . 4,369 parts In-Stock

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$34.090

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$27.954

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4,369

$34.090

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IDEA Electronic Components Group

UK . 1,543 parts In-Stock

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$34.090

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$32.386

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$30.681

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Corphita

USA . 2,103 parts In-Stock

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Microchip USA

USA . 110 parts In-Stock

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Overview

Unlock the power of innovation with the LM4F232H5BBFIGR by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers unparalleled quality and reliability in every product. This cutting-edge microcontroller offers endless possibilities for applications in various industries, providing customers with efficient solutions that enhance performance and productivity. Experience the value and benefits of the LM4F232H5BBFIGR, and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and resistance to harsh environmental conditions, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability provides ease of assembly and integration into circuit boards, saving space and reducing production costs.

Bit Size: 32

32-bit architecture allows for faster processing and complex calculations, making the microcontroller suitable for high-performance applications.

Power Supplies (V): 1.2, 3.3

Support for multiple power supply voltages (1.2V and 3.3V) enhances flexibility in designing and powering the system.

No. of Terminals: 157

A high number of terminals enable connectivity to a wide range of external components and peripherals, expanding the functionality of the microcontroller.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array and fine pitch package style optimize signal integrity and thermal performance, ensuring reliable operation in demanding industrial environments.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows the microcontroller to operate reliably in harsh industrial environments with varying temperature conditions.

CPU Family: CORTEX-M4F

The CORTEX-M4F CPU family offers high performance and energy efficiency, making the microcontroller suitable for power-sensitive applications that require processing capabilities.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures reliable operation in cold environments, making the microcontroller suitable for a wide range of industrial applications.

ROM Words: 262144

Large ROM size of 262144 words allows for storing complex programs and data, making the microcontroller suitable for applications that require extensive memory storage.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments with wide temperature variations, making the microcontroller suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller peripheral IC type provide high performance and efficient processing capabilities, making the microcontroller suitable for real-time control applications.

RAM Bytes: 32768

Large RAM size of 32768 bytes allows for efficient data storage and retrieval, making the microcontroller suitable for multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller suitable for energy-efficient and reliable operation in various applications.

Terminal Form: BALL

Ball terminal form ensures reliable electrical connections and easy soldering during assembly, enhancing the overall reliability and longevity of the microcontroller.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates, enabling quick customization and adaptation to changing requirements in the field.

Terminal Pitch: 0.635 mm

Fine terminal pitch of 0.635mm allows for dense packing and high-density integration on circuit boards, saving space and enabling compact designs.

Speed: 80 rpm

High processing speed of 80 rpm enables rapid execution of instructions and real-time responsiveness, making the microcontroller suitable for time-critical applications.

Technical Specifications

Microcontrollers LM4F232H5BBFIGR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

Bit Size:

32

CPU Family:

CORTEX-M4F

JESD-30 Code:

S-PBGA-B157

No. of Terminals:

157

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA157,13X13,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

80 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

LM4F232H5BBFIGR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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