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LM3S8933-EQC50-A2T

Texas Instruments

LM3S8933-EQC50-A2T by Texas Instruments

LM3S8933-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 8.192 MHz, making it suitable for industrial applications requiring high-speed processing and control capabilities. With features like PWM channels and ADC support, this microcontroller is ideal for tasks that demand precise analog signal processing and pulse-width modulation functionalities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,585 parts In-Stock

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8,585

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Digiode

USA . 3,214 parts In-Stock

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3,214

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Distributors (Availability)

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AZTECH Wire

Italy . 670 parts In-Stock

1+ parts

$4.919

100+ parts

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670

$4.919

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One Stop Electronics

USA . 582 parts In-Stock

1+ parts

$6.000

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582

$6.000

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Parana Technologies

USA . 1,245 parts In-Stock

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$51.594

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1,245

$51.594

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ChromeModa Solutions

Germany . 4,614 parts In-Stock

1+ parts

$57.971

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$47.536

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4,614

$57.971

$47.536

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IDEA Electronic Components Group

UK . 1,019 parts In-Stock

1+ parts

$57.971

100+ parts

$55.072

1k+ parts

$52.174

10k+ parts

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1,019

$57.971

$55.072

$52.174

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Corphita

USA . 3,138 parts In-Stock

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3,138

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DigiPath Technology Company

USA . 1,361 parts In-Stock

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$52.267

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1,361

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$52.267

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Microchip USA

USA . 343 parts In-Stock

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343

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Overview

Unlock the power of innovation with the LM3S8933-EQC50-A2T by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers top-quality products that are versatile and reliable. Perfect for a wide range of applications, this microcontroller offers exceptional value with its advanced features and capabilities. From industrial automation to consumer electronics, the LM3S8933-EQC50-A2T provides the performance and efficiency you need to bring your projects to life. Experience the benefits of cutting-edge technology and unleash your creativity with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 2.75 V

Operates efficiently at a relatively low maximum supply voltage, saving energy and reducing heat dissipation.

Package Shape: SQUARE

Square package shape allows for more compact and efficient placement on a circuit board.

Bit Size: 32

32-bit processing capability provides higher performance and computing power for the microcontroller.

Power Supplies (V): 2.5,3.3

Ability to operate at multiple power supply voltages offers flexibility in different applications.

No. of Terminals: 100

Ample number of terminals allow for versatile connectivity and integration with other components.

Package Style (Meter): FLATPACK

Flatpack package style offers efficient heat dissipation and compact design for space-constrained applications.

Minimum Supply Voltage: 2.25 V

Works reliably at a low minimum supply voltage, ensuring stable operation in various conditions.

Maximum Operating Temperature: 105 °C

High maximum operating temperature range allows for use in industrial environments or applications with high heat.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range enables operation in cold environments or extreme conditions.

ADC Channels: YES

Analog-to-digital converter (ADC) channels allow for interfacing with analog sensors or signals.

Terminal Position: QUAD

Quad terminal position provides stability and robustness in connecting the microcontroller to external components.

ROM Words: 262144

Large ROM capacity allows for storing a significant amount of code or data in the microcontroller.

Maximum Seated Height: 1.6 mm

Low seated height enables slim and compact designs for devices integrating this microcontroller.

Width: 14 mm

Moderate width allows for efficient placement and spacing on a circuit board.

Maximum Clock Frequency: 8.192 MHz

High clock frequency provides fast processing speed and responsiveness in executing instructions.

Length: 14 mm

Compact length allows for space-saving integration in electronic devices or systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and performance in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing (RISC) architecture for efficient and streamlined processing.

RAM Bytes: 65536

Large RAM capacity provides ample memory for temporary data storage and efficient multitasking.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: GULL WING

Gull wing terminal form ensures secure mounting and reliable connectivity on the circuit board.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and reliability of the microcontroller.

PWM Channels: YES

Pulse-width modulation (PWM) channels enable precise control of output signals for various applications.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates to the microcontroller's firmware or software.

Terminal Pitch: 0.5 mm

Narrow terminal pitch facilitates high-density mounting and compact board layout.

Speed: 50 rpm

Capable of handling processing speed of 50 revolutions per minute, suitable for a wide range of applications.

No. of I/O Lines: 36

Plenty of input/output lines provide versatility in connecting external devices and peripherals to the microcontroller.

Technical Specifications

Microcontrollers LM3S8933-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

36

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8933-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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