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LM3S8730-IQC50-A2

Texas Instruments

LM3S8730-IQC50-A2 by Texas Instruments

Texas Instruments' LM3S8730-IQC50-A2 microcontroller features 32-bit architecture, 131072 ROM words, and 65536 RAM bytes. With a max clock frequency of 8.192 MHz, it is ideal for industrial applications requiring high-speed processing and multiple PWM channels. The compact square package with a flatpack style makes it suitable for space-constrained designs.

Median Price

$14.502

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 876 parts In-Stock

1+ parts

-

100+ parts

$12.890

1k+ parts

$11.530

10k+ parts

$10.860

876

-

$12.890

$11.530

$10.860

Verical

USA . 720 parts In-Stock

1+ parts

-

100+ parts

$16.113

1k+ parts

$14.412

10k+ parts

$13.575

720

-

$16.113

$14.412

$13.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 443 parts In-Stock

1+ parts

$13.604

100+ parts

-

1k+ parts

-

10k+ parts

-

443

$13.604

-

-

-

Vyrian

USA . 7,359 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,359

-

-

-

-

DigiKey Marketplace

USA . 89 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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89

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 872 parts In-Stock

1+ parts

$12.170

100+ parts

-

1k+ parts

-

10k+ parts

-

872

$12.170

-

-

-

Corphita

USA . 1,010 parts In-Stock

1+ parts

$12.888

100+ parts

-

1k+ parts

-

10k+ parts

-

1,010

$12.888

-

-

-

Parana Technologies

USA . 401 parts In-Stock

1+ parts

$20.395

100+ parts

$1,894.007

1k+ parts

$18.356

10k+ parts

-

401

$20.395

$1,894.007

$18.356

-

DigiPath Technology Company

USA . 1,657 parts In-Stock

1+ parts

$22.458

100+ parts

-

1k+ parts

-

10k+ parts

-

1,657

$22.458

-

-

-

ChromeModa Solutions

Germany . 5,589 parts In-Stock

1+ parts

$22.916

100+ parts

$18.791

1k+ parts

-

10k+ parts

-

5,589

$22.916

$18.791

-

-

IDEA Electronic Components Group

UK . 418 parts In-Stock

1+ parts

$22.916

100+ parts

$21.770

1k+ parts

$20.624

10k+ parts

-

418

$22.916

$21.770

$20.624

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QUARKTWIN TECHNOLOGY LTD

USA . 27,997 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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27,997

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-

-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

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-

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Microchip USA

USA . 2,519 parts In-Stock

1+ parts

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100+ parts

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2,519

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-

-

Overview

Unleash the power of innovation with the LM3S8730-IQC50-A2 microcontroller from Texas Instruments. Designed with precision and reliability in mind, this cutting-edge product offers unmatched performance in a compact package. Ideal for a wide range of applications, this microcontroller boasts advanced features like ADC channels, PWM channels, and ROM programmability. Experience seamless operation and superior functionality with Texas Instruments' top-of-the-line technology. Upgrade your projects today with the LM3S8730-IQC50-A2 microcontroller and stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures long-lasting performance and reliability.

Surface Mount: YES

Easy to integrate into PCB designs, saving space and simplifying assembly.

Maximum Supply Voltage: 2.75 V

Optimal voltage range for efficient operation and power consumption.

Package Shape: SQUARE

Compact shape allows for efficient use of board space.

Bit Size: 32

Provides high processing power and capability for various applications.

Power Supplies (V): 2.5, 3.3

Versatile voltage options for compatibility with different systems.

No. of Terminals: 100

Sufficient terminals for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK

Flatpack design allows for easy mounting and secure placement on PCBs.

Minimum Supply Voltage: 2.25 V

Ensures stable operation even at lower voltages.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for various environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme temperature conditions.

Terminal Finish: TIN

Tin finish provides good electrical conductivity and solderability.

ADC Channels: YES

Analog-to-digital converter channels for interfacing with analog sensors and signals.

Terminal Position: QUAD

Quad-terminal configuration for stable and secure connections.

ROM Words: 131072

Large ROM capacity for storing program codes and data.

Maximum Seated Height: 1.6 mm

Low-profile design suitable for space-constrained applications.

Width: 14 mm

Compact width for efficient board layout and space utilization.

Maximum Clock Frequency: 8.192 MHz

High clock frequency for fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient reflow time for reliable solder joints during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature for secure solder connections.

Length: 14 mm

Compact length for efficient board space utilization.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and high-speed processing.

RAM Bytes: 65536

Large RAM capacity for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high integration.

Terminal Form: GULL WING

Gull-wing terminals for secure and reliable soldering.

Nominal Supply Voltage: 2.5 V

Stable nominal voltage for consistent performance.

PWM Channels: YES

Pulse-width modulation channels for precise control of output signals.

ROM Programmability: FLASH

Flash ROM for easy and quick programming of the device.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture during storage and handling.

Speed: 50 rpm

Capable of processing data at a speed of 50 revolutions per minute.

No. of I/O Lines: 32

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S8730-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8730-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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