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LM3S818-IGZ50-C2T

Texas Instruments

LM3S818-IGZ50-C2T by Texas Instruments

LM3S818-IGZ50-C2T by Texas Instruments is a 32-bit microcontroller with 48 terminals, operating at up to 8 MHz. It features 8192 bytes of RAM, ADC and PWM channels, and flash ROM programmability. Ideal for industrial applications requiring a compact chip carrier package with a wide temperature range from -40°C to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,450 parts In-Stock

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7,450

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Digiode

USA . 1,869 parts In-Stock

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1,869

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Distributors (Availability)

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One Stop Electronics

USA . 1,437 parts In-Stock

1+ parts

$8.000

100+ parts

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1,437

$8.000

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AZTECH Wire

Italy . 506 parts In-Stock

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$8.340

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506

$8.340

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Parana Technologies

USA . 2,012 parts In-Stock

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$14.494

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$14.937

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2,012

$14.494

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$14.937

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ChromeModa Solutions

Germany . 2,192 parts In-Stock

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$16.285

100+ parts

$13.354

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2,192

$16.285

$13.354

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IDEA Electronic Components Group

UK . 672 parts In-Stock

1+ parts

$16.285

100+ parts

$15.471

1k+ parts

$14.656

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672

$16.285

$15.471

$14.656

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QUARKTWIN TECHNOLOGY LTD

USA . 17,728 parts In-Stock

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17,728

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Microchip USA

USA . 2,829 parts In-Stock

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2,829

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Corphita

USA . 1,734 parts In-Stock

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1,734

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DigiPath Technology Company

USA . 1,000 parts In-Stock

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$14.683

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1,000

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$14.683

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Overview

Get ready to revolutionize your projects with the LM3S818-IGZ50-C2T microcontroller from Texas Instruments. With cutting-edge technology and exceptional reliability, Texas Instruments is a trusted manufacturer in the electronics industry. This microcontroller is perfect for a wide range of applications, offering high performance and versatility. Whether you're working on robotics, IoT devices, or industrial automation, this microcontroller delivers unparalleled value and benefits to help you bring your ideas to life. Trust Texas Instruments to power your next innovation.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and efficient mounting onto a printed circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Provides a higher operating voltage capability, increasing the versatility and compatibility of the microcontroller.

Package Shape: SQUARE

The square package shape makes it easier to design and layout the PCB, optimizing space and ensuring efficient use of the available area.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex tasks and calculations with precision and efficiency.

Power Supplies (V): 3.3

The 3.3V power supply is a common and stable voltage level, ensuring reliable operation of the microcontroller.

No. of Terminals: 48

A higher number of terminals provide more connectivity options and flexibility for interfacing with external components and peripherals.

Package Style (Meter): CHIP CARRIER

The chip carrier style package offers good protection for the microcontroller and is well-suited for surface mount applications.

Minimum Supply Voltage: 3 V

With a minimum supply voltage of 3V, the microcontroller can operate within a range that is suitable for various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in harsh environmental conditions or industrial settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the microcontroller can function in cold environments without any issues.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors or signals, expanding its usability for sensor-based applications.

Terminal Position: QUAD

The quad terminal position offers a balanced layout for connecting external devices, making it easier to route signals and reduce interference.

ROM Words: 65536

With 65,536 ROM words, this microcontroller has sufficient memory capacity to store program instructions and data for various functions.

Maximum Seated Height: 1 mm

The low maximum seated height allows for compact design and integration of the microcontroller into space-constrained applications.

Width: 6.875 mm

The narrow width of the microcontroller makes it suitable for compact PCB designs, where space efficiency is crucial.

Maximum Clock Frequency: 8 MHz

The high clock frequency of 8 MHz enables fast processing and execution of commands, enhancing the overall performance of the microcontroller.

Length: 6.875 mm

The short length of the microcontroller allows for flexibility in board layout and placement, especially in small electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation across a wide temperature range, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient and streamlined processing, leading to faster execution of instructions and reduced power consumption.

RAM Bytes: 8192

With 8,192 bytes of RAM, this microcontroller can handle data storage and manipulation for various computational tasks and algorithms.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the microcontroller suitable for battery-powered or noise-sensitive applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process during assembly, enhancing the reliability and durability of the connections.

Maximum Supply Current: 110 mA

The maximum supply current of 110 mA indicates the power consumption of the microcontroller, allowing for efficient power management and design considerations.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V serves as a stable reference for the microcontroller's operation, ensuring consistent performance under varying load conditions.

PWM Channels: YES

The presence of PWM channels enables precise control of analog signals, making the microcontroller suitable for applications requiring accurate voltage or power modulation.

ROM Programmability: FLASH

Being flash programmable, the microcontroller allows for easy and quick updates to the firmware or software, enhancing flexibility and adaptability in applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting and interconnection, enabling miniaturization and compact design of electronic devices.

Speed: 50 rpm

With a speed rating of 50 rpm, this microcontroller can process instructions and signals at a fast pace, suitable for applications requiring quick response times.

No. of I/O Lines: 30

The 30 I/O lines offer abundant connectivity options for interfacing with external devices, sensors, and peripherals, making the microcontroller versatile and adaptable for various applications.

Technical Specifications

Microcontrollers LM3S818-IGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S818-IGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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