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LM3S811-IGZ50-C2T

Texas Instruments

LM3S811-IGZ50-C2T by Texas Instruments

LM3S811-IGZ50-C2T by Texas Instruments is a 32-bit microcontroller with 48 terminals, operating at a max frequency of 0.032 MHz. It features 8192 bytes of RAM and 65536 ROM words, suitable for industrial applications requiring ADC channels and PWM functionality. With a package style of CHIP CARRIER and terminal pitch of 0.5 mm, it offers reliable performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,851 parts In-Stock

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Digiode

USA . 3,733 parts In-Stock

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3,733

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Distributors (Availability)

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One Stop Electronics

USA . 309 parts In-Stock

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$10.000

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309

$10.000

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AZTECH Wire

Italy . 282 parts In-Stock

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$11.381

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$11.381

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Parana Technologies

USA . 1,699 parts In-Stock

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$76.915

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$76.915

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DigiPath Technology Company

USA . 662 parts In-Stock

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$84.693

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$77.917

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662

$84.693

$77.917

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ChromeModa Solutions

Germany . 2,153 parts In-Stock

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$86.421

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$70.865

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2,153

$86.421

$70.865

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IDEA Electronic Components Group

UK . 571 parts In-Stock

1+ parts

$86.421

100+ parts

$82.100

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$77.779

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571

$86.421

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$77.779

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Corphita

USA . 4,755 parts In-Stock

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Microchip USA

USA . 2,652 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the LM3S811-IGZ50-C2T microcontroller by Texas Instruments. Known for their superior quality and reliability, Texas Instruments brings you a versatile solution for a wide range of applications. With its advanced features and high performance, this microcontroller offers unmatched value and benefits to customers looking to streamline their projects. Whether you're working on robotics, automation, or IoT devices, the LM3S811-IGZ50-C2T is the perfect choice for your next innovation. Experience the difference with Texas Instruments today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing overall product size.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltage options, making the microcontroller versatile for different power supply configurations.

Package Shape: SQUARE

Square package shape provides stability and ease of handling during the assembly process.

Bit Size: 32

32-bit architecture ensures high processing capability and performance for various applications.

Power Supplies (V): 3.3

Stable voltage supply of 3.3V ensures reliable and consistent operation of the microcontroller.

No. of Terminals: 48

Ample number of terminals enable connection to external components and interfaces for enhanced functionality.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers protection and compact design for space-constrained applications.

Minimum Supply Voltage: 3 V

Wide range of supply voltage allows for flexibility in different power supply setups.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in challenging environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables the microcontroller to function in a wide range of temperature conditions.

ADC Channels: YES

Analog-to-digital converter channels support analog signal processing, making the microcontroller suitable for sensor applications.

Terminal Position: QUAD

Quad terminal position offers efficient component placement and connection layout on the PCB.

ROM Words: 65536

Large ROM capacity of 65536 words allows for storage of extensive program code and data.

Maximum Seated Height: 1 mm

Low maximum seated height facilitates compact and slim designs for electronic products.

Width: 6.875 mm

Narrow width enables space-saving integration of the microcontroller in tight layouts and small form factor devices.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032 MHz ensures fast processing and responsiveness in real-time applications.

Length: 6.875 mm

Short length allows for efficient placement on the PCB, optimizing space utilization.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures robust performance in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient instruction execution and high-speed processing capabilities.

RAM Bytes: 8192

Ample RAM capacity of 8192 bytes supports data storage and manipulation for various computing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the microcontroller.

Terminal Form: NO LEAD

No lead terminal form simplifies soldering and enhances electrical connections for improved performance.

Maximum Supply Current: 110 mA

Moderate maximum supply current of 110 mA ensures power efficiency and prevents overheating issues.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V provides a standard operating voltage for consistent performance.

PWM Channels: YES

Pulse-width modulation channels enable precise control of output signals for applications such as motor speed control and LED dimming.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates of the program code, enhancing flexibility and adaptability.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density mounting of the microcontroller, ideal for compact electronic devices.

Speed: 50 rpm

Speed rating of 50 rpm indicates the processing speed capability of the microcontroller, suitable for a wide range of applications.

No. of I/O Lines: 32

Ample number of input/output lines allow for versatile connectivity and interfacing with external devices for diverse functionality.

Technical Specifications

Microcontrollers LM3S811-IGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S811-IGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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