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LM3S6432-IQC50-A2

Texas Instruments

LM3S6432-IQC50-A2 by Texas Instruments

LM3S6432-IQC50-A2 by Texas Instruments is a 32-bit microcontroller with Cortex-M3 CPU family, offering 32768 bytes of RAM and 98304 ROM words. It features 3 ADC channels, PWM(2), TIMER(3), WDT peripherals, and connectivity options like Ethernet, I2C, SSI, UART. Ideal for industrial applications requiring low power mode and fixed-point format operations at a max clock frequency of 0.032 MHz.

Median Price

$55.380

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 146 parts In-Stock

1+ parts

$55.380

100+ parts

$40.647

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146

$55.380

$40.647

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Distributors (In-Stock)

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Nova Conductors

Japan . 20 parts In-Stock

1+ parts

$34.409

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20

$34.409

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Digiode

USA . 4,446 parts In-Stock

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$39.501

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4,446

$39.501

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Vyrian

USA . 5,058 parts In-Stock

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5,058

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Chip Stock

USA . 529 parts In-Stock

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529

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Inventory MP

USA . 43 parts In-Stock

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43

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Bristol Electronics

USA . 43 parts In-Stock

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43

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Distributors (Availability)

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AZTECH Wire

Italy . 253 parts In-Stock

1+ parts

$14.591

100+ parts

-

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253

$14.591

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Netroflash

USA . 100 parts In-Stock

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$34.409

100+ parts

$33.720

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100

$34.409

$33.720

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Ampacity Inc.

Singapore . 226 parts In-Stock

1+ parts

$35.340

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226

$35.340

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Corphita

USA . 3,447 parts In-Stock

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$37.422

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3,447

$37.422

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Parana Technologies

USA . 1,609 parts In-Stock

1+ parts

$55.594

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1,609

$55.594

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DigiPath Technology Company

USA . 2,336 parts In-Stock

1+ parts

$61.216

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2,336

$61.216

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ChromeModa Solutions

Germany . 5,048 parts In-Stock

1+ parts

$62.465

100+ parts

$51.221

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5,048

$62.465

$51.221

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IDEA Electronic Components Group

UK . 500 parts In-Stock

1+ parts

$62.465

100+ parts

$59.342

1k+ parts

$56.218

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500

$62.465

$59.342

$56.218

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Microchip USA

USA . 2,221 parts In-Stock

1+ parts

$99.410

100+ parts

$97.680

1k+ parts

$96.810

10k+ parts

$95.950

2,221

$99.410

$97.680

$96.810

$95.950

S.R.D Solutions

India . 51,000 parts In-Stock

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Lixinc

USA . 8,148 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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A-Z Elektronik GmbH

Germany . 386 parts In-Stock

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386

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Overview

Experience the power of innovation with the Texas Instruments LM3S6432-IQC50-A2 microcontroller. Crafted with precision and expertise, this high-quality product offers unmatched performance and reliability. Ideal for a wide range of applications, this microcontroller is designed to meet your diverse needs with ease. From its integrated cache to its low power mode, this product delivers exceptional value and benefits to customers. Trust Texas Instruments for cutting-edge technology that empowers you to achieve more. Elevate your projects with the LM3S6432-IQC50-A2 microcontroller today.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Lightweight and durable material for easy handling and long-lasting performance.

Integrated Cache:

YES - Faster data access and improved overall system performance.

Surface Mount:

YES - Easy integration into circuit boards for compact and efficient designs.

Maximum Supply Voltage:

2.75 V - Optimal voltage range for stable and reliable operation.

On Chip Data RAM Width:

8 - Efficient data processing and storage capabilities.

Package Shape:

SQUARE - Space-saving design for versatile application in various setups.

Bit Size:

32 - High processing power and capability for complex tasks.

Power Supplies (V):

2.5,3.3 - Compatible with common power sources for ease of use.

No. of Terminals:

100 - Sufficient connectivity options for versatile hardware connections.

Package Style (Meter):

FLATPACK - Streamlined design for easy installation and maintenance.

Minimum Supply Voltage:

2.25 V - Operational at lower voltages for energy efficiency.

Maximum Operating Temperature:

85 °C - Resilient performance in high-temperature environments.

CPU Family:

CORTEX-M3 - Trusted and reliable processor design for consistent performance.

Minimum Operating Temperature:

40 °C - Operable in extreme cold conditions for versatile use.

Terminal Finish:

NICKEL PALLADIUM GOLD - Robust terminal finish for durable and reliable connections.

ADC Channels:

YES - Accurate analog to digital conversion for precise data input.

Terminal Position:

QUAD - Secure terminal positioning for stable connections.

ROM Words:

98304 - Ample memory storage for versatile data processing.

Maximum Seated Height:

1.6 mm - Low profile design for compact installations.

Width:

14 mm - Slim width for flexible placement in various setups.

Boundary Scan:

YES - Efficient testing and debugging capabilities for optimal performance.

Peripherals:

PWM(2), TIMER(3), WDT - Versatile peripheral options for diverse functionality.

Maximum Clock Frequency:

0.032 MHz - High clock frequency for fast data processing.

Maximum Time At Peak Reflow Temperature (s):

30 - Resilient to high-temperature reflow processes for durability.

Peak Reflow Temperature °C:

260 - Withstands high-temperature soldering processes for reliable connections.

Length:

14 mm - Compact length for versatile installation options.

Temperature Grade:

INDUSTRIAL - Suitable for industrial applications with rugged performance requirements.

Peripheral IC Type:

MICROCONTROLLER, RISC - Advanced peripheral and processing capabilities for complex tasks.

No. of Timers:

3 - Multiple timer options for efficient task scheduling.

RAM Bytes:

32768 - Large RAM capacity for extensive data storage and processing.

Technology:

CMOS - Energy-efficient technology for optimized power consumption.

Terminal Form:

GULL WING - Secure terminal form for stable connections.

Analog To Digital Convertors:

3-Ch 10-Bit - Accurate analog to digital conversion for precise data acquisition.

Nominal Supply Voltage:

2.5 V - Stable supply voltage for consistent performance.

No. of Serial I/Os:

3 - Multiple serial I/O options for versatile data communication.

PWM Channels:

YES - Efficient PWM channels for precise control of peripherals.

Connectivity:

ETHERNET, I2C, SSI, UART - Multiple connectivity options for diverse communication needs.

ROM Programmability:

FLASH - Flexibility to reprogram ROM for versatile applications.

Terminal Pitch:

0.5 mm - Fine terminal pitch for precise connections.

Format:

FIXED POINT - Accurate fixed-point arithmetic for precise calculations.

Moisture Sensitivity Level (MSL):

3 - Resistant to moisture for reliable operation in various environments.

Speed:

50 rpm - Variable speed capabilities for versatile performance requirements.

Low Power Mode:

YES - Energy-saving mode for prolonged battery life.

On Chip Program ROM Width:

8 - Efficient program storage and execution capabilities.

No. of I/O Lines:

30 - Ample I/O lines for versatile input/output options.

Technical Specifications

Microcontrollers LM3S6432-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, I2C, SSI, UART

Peripherals:

PWM(2), TIMER(3), WDT

Analog To Digital Convertors:

3-Ch 10-Bit

Trade Compliance

LM3S6432-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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