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LM3S6432-IBZ50-A2T

Texas Instruments

LM3S6432-IBZ50-A2T by Texas Instruments

Texas Instruments LM3S6432-IBZ50-A2T microcontroller features 32-bit architecture, 32768 bytes of RAM, and 98304 ROM words. Ideal for industrial applications, it offers Ethernet connectivity, 3 ADC channels, and low power mode for efficient operation in a compact square package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,400 parts In-Stock

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Digiode

USA . 1,255 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 416 parts In-Stock

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$7.565

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One Stop Electronics

USA . 345 parts In-Stock

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$9.000

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$9.000

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Ampacity Inc.

Singapore . 556 parts In-Stock

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$32.000

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Parana Technologies

USA . 2,157 parts In-Stock

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$76.787

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DigiPath Technology Company

USA . 1 parts In-Stock

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$84.551

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1

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ChromeModa Solutions

Germany . 5,934 parts In-Stock

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$86.277

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$70.747

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IDEA Electronic Components Group

UK . 1,635 parts In-Stock

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$86.277

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$81.963

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$77.649

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Corphita

USA . 3,831 parts In-Stock

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Microchip USA

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Overview

Unlock endless possibilities with the LM3S6432-IBZ50-A2T by Texas Instruments. This cutting-edge microcontroller, part of the renowned Cortex-M3 family, offers unparalleled performance and reliability for a wide range of applications. Whether you're designing smart devices, industrial automation systems, or IoT solutions, this powerhouse delivers seamless connectivity, low power consumption, and advanced peripherals like PWM and timers. Trust Texas Instruments' expertise to elevate your projects to the next level. Experience innovation at its finest with the LM3S6432-IBZ50-A2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the microcontroller, making it suitable for a wide range of applications.

Integrated Cache: YES

The integrated cache improves the performance of the microcontroller by storing frequently accessed data, reducing the need to fetch data from the main memory every time.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V ensures safe operation and prevents damage to the microcontroller, offering reliability in various voltage supply scenarios.

On Chip Data RAM Width: 8

The 8-bit data RAM width allows for efficient data processing and storage, enhancing the overall performance of the microcontroller.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle larger data sets and perform complex calculations, making it suitable for demanding applications.

No. of Terminals: 108

Having 108 terminals provides flexibility in connectivity options and allows for interfacing with various external devices, expanding the functionality of the microcontroller.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 85°C ensures reliable performance in harsh environmental conditions, making it suitable for industrial applications.

ADC Channels: YES

The presence of Analog to Digital Converter (ADC) channels enables the microcontroller to read analog signals from external sensors or devices, making it versatile for different types of input data.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computing (RISC) architecture microcontroller enhances the speed and performance of the device, making it efficient in executing instructions.

No. of Timers: 3

Having three timers allows for accurate timekeeping, event scheduling, and synchronization, which is vital in many real-time applications.

Technical Specifications

Microcontrollers LM3S6432-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

43

No. of Serial I/Os:

3

No. of Terminals:

108

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, I2C, SSI, UART

Peripherals:

PWM(2), TIMER(3), WDT

Analog To Digital Convertors:

3-Ch 10-Bit

Trade Compliance

LM3S6432-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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