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LM3S613-IQN50-C2

Texas Instruments

LM3S613-IQN50-C2 by Texas Instruments

LM3S613-IQN50-C2 by Texas Instruments is a 32-bit microcontroller with Cortex-M3 CPU, 8192 bytes of RAM, and 32768 ROM words. It features 4 ADC channels, 4 PWM channels, and connectivity options like I2C and UART. Ideal for industrial applications requiring low power consumption and high-speed processing up to 50 MHz.

Median Price

$8.520

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19 parts In-Stock

1+ parts

-

100+ parts

$8.520

1k+ parts

$7.620

10k+ parts

$7.180

19

-

$8.520

$7.620

$7.180

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,119 parts In-Stock

1+ parts

$8.996

100+ parts

-

1k+ parts

-

10k+ parts

-

1,119

$8.996

-

-

-

Vyrian

USA . 3,363 parts In-Stock

1+ parts

-

100+ parts

-

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-

3,363

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 801 parts In-Stock

1+ parts

$8.523

100+ parts

-

1k+ parts

-

10k+ parts

-

801

$8.523

-

-

-

Component Stockers USA

USA . 17 parts In-Stock

1+ parts

$9.620

100+ parts

-

1k+ parts

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-

17

$9.620

-

-

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AZTECH Wire

Italy . 1,014 parts In-Stock

1+ parts

$11.100

100+ parts

-

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1,014

$11.100

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-

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Parana Technologies

USA . 2,209 parts In-Stock

1+ parts

$48.680

100+ parts

-

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2,209

$48.680

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DigiPath Technology Company

USA . 313 parts In-Stock

1+ parts

$53.603

100+ parts

$49.315

1k+ parts

-

10k+ parts

-

313

$53.603

$49.315

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ChromeModa Solutions

Germany . 2,214 parts In-Stock

1+ parts

$54.697

100+ parts

$44.852

1k+ parts

-

10k+ parts

-

2,214

$54.697

$44.852

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IDEA Electronic Components Group

UK . 1,624 parts In-Stock

1+ parts

$54.697

100+ parts

$51.962

1k+ parts

$49.227

10k+ parts

-

1,624

$54.697

$51.962

$49.227

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Microchip USA

USA . 378 parts In-Stock

1+ parts

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378

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Overview

Unlock limitless possibilities with the Texas Instruments LM3S613-IQN50-C2 microcontroller. Crafted with precision and expertise, this powerful device offers unmatched reliability and performance for a wide range of applications. From industrial automation to consumer electronics, this microcontroller provides seamless connectivity and efficient processing capabilities. Trust in Texas Instruments to deliver top-notch quality and innovation that exceeds expectations. Elevate your projects with the LM3S613-IQN50-C2 and experience the ultimate in value, flexibility, and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Integrated Cache: YES

The integrated cache helps to improve the performance of the microcontroller by temporarily storing frequently accessed data.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller allows for efficient processing of instructions, leading to faster overall performance.

Maximum Clock Frequency: 50 MHz

The high clock frequency enables rapid processing of tasks and data, making this microcontroller suitable for applications requiring real-time performance.

RAM Bytes: 8192

With a large amount of RAM, this microcontroller can handle complex tasks and store data efficiently.

Analog To Digital Convertors: 4-Ch 10-Bit

The multiple ADC channels with 10-bit resolution enable the microcontroller to accurately convert analog signals to digital values, essential for sensor interfacing and data acquisition.

Connectivity: I2C, SSI, UART(2)

The multiple connectivity options make it versatile and compatible with various communication interfaces, allowing for easy integration into different systems.

Technical Specifications

Microcontrollers LM3S613-IQN50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI, UART(2)

Peripherals:

PWM(4), TIMER(3), WDT

Analog To Digital Convertors:

4-Ch 10-Bit

Trade Compliance

LM3S613-IQN50-C2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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