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LM3S600-EGZ50-C2

Texas Instruments

LM3S600-EGZ50-C2 by Texas Instruments

Texas Instruments' LM3S600-EGZ50-C2 is a 32-bit microcontroller with 36 I/O lines, PWM channels, and ADC channels. Operating at up to 32 MHz, it features flash ROM programmability and a max supply voltage of 3.6V. Ideal for industrial applications requiring high-speed processing in a compact square chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,881 parts In-Stock

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Digiode

USA . 84 parts In-Stock

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AZTECH Wire

Italy . 592 parts In-Stock

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$5.131

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592

$5.131

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One Stop Electronics

USA . 1,186 parts In-Stock

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$23.000

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Parana Technologies

USA . 973 parts In-Stock

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$32.316

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$104.331

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973

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ChromeModa Solutions

Germany . 3,754 parts In-Stock

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$36.310

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$29.774

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3,754

$36.310

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IDEA Electronic Components Group

UK . 666 parts In-Stock

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$36.310

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$34.494

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$32.679

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666

$36.310

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Microchip USA

USA . 2,218 parts In-Stock

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DigiPath Technology Company

USA . 1,681 parts In-Stock

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Corphita

USA . 1,135 parts In-Stock

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Overview

Discover the limitless possibilities with the LM3S600-EGZ50-C2 microcontroller from Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. This versatile microcontroller is perfect for a wide range of applications, offering customers exceptional value and benefits. Whether you're working on robotics, automation, or IoT projects, this compact yet powerful device will exceed your expectations. Embrace innovation and efficiency with the LM3S600-EGZ50-C2 microcontroller today!

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure mounting on PCBs, enabling efficient assembly and saving space.

Maximum Supply Voltage: 3.6 V

Can handle a wide range of supply voltages, making it versatile for different applications.

Package Shape: SQUARE

Square shape helps optimize space on the PCB and allows for efficient placement and routing of traces.

Bit Size: 32

Offers a good balance between performance and power efficiency for various computing tasks.

No. of Terminals: 48

Provides a good number of I/O pins for interfacing with external components, sensors, and devices.

Package Style: CHIP CARRIER

Chip carrier package offers reliable protection and easy handling during manufacturing and assembly processes.

Minimum Supply Voltage: 3 V

Ensures stable operation at lower supply voltages without compromising performance.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures, making it suitable for industrial applications.

ADC Channels: YES

Integrated ADC channels enable analog signal processing and conversion, expanding the range of applications.

Terminal Position: QUAD

Quad terminal position helps in easy identification and organization of I/O pins for efficient circuit design.

Maximum Seated Height: 1 mm

Low seated height allows for a slim and compact design, ideal for space-constrained applications.

Width: 6.875 mm

Narrow width makes it easier to fit into tight spaces on the PCB, improving overall layout efficiency.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency offers fast processing speed, enhancing the overall performance of the microcontroller.

Length: 6.875 mm

Compact length enables a space-saving design and efficient placement on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient and fast execution of instructions, enhancing overall system performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for energy-efficient applications.

Terminal Form: NO LEAD

No-lead terminal form simplifies the manufacturing process and enhances durability and reliability.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance over a range of operating conditions.

PWM Channels: YES

Integrated PWM channels enable precise control of output signals, ideal for motor control and power regulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to the firmware, enhancing flexibility and scalability.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting of the device, saving space on the PCB and improving overall design efficiency.

Speed: 50 rpm

Can process instructions at a speed of 50 rpm, suitable for a wide range of applications requiring real-time processing.

No. of I/O Lines: 36

Provides a sufficient number of I/O lines for interfacing with external components, peripherals, and sensors.

Technical Specifications

Microcontrollers LM3S600-EGZ50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S600-EGZ50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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