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LM3S5956-IQR80-C3

Texas Instruments

LM3S5956-IQR80-C3 by Texas Instruments

LM3S5956-IQR80-C3 by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features ADC and DMA channels, suitable for industrial applications requiring high-speed processing and PWM control. With a supply voltage range of 3V to 3.6V, it offers reliable performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,895 parts In-Stock

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2,895

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Vyrian

USA . 489 parts In-Stock

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489

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Distributors (Availability)

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AZTECH Wire

Italy . 385 parts In-Stock

1+ parts

$12.271

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385

$12.271

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Parana Technologies

USA . 842 parts In-Stock

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$30.121

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$67.319

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842

$30.121

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One Stop Electronics

USA . 1,546 parts In-Stock

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$33.000

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1,546

$33.000

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DigiPath Technology Company

USA . 203 parts In-Stock

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$33.167

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$30.514

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203

$33.167

$30.514

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ChromeModa Solutions

Germany . 4,026 parts In-Stock

1+ parts

$33.844

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$27.752

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4,026

$33.844

$27.752

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IDEA Electronic Components Group

UK . 1,397 parts In-Stock

1+ parts

$33.844

100+ parts

$32.152

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$30.460

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1,397

$33.844

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$30.460

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Corphita

USA . 1,296 parts In-Stock

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Microchip USA

USA . 406 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments LM3S5956-IQR80-C3 microcontroller. Designed with precision and quality in mind, Texas Instruments is a trusted manufacturer known for delivering top-notch products. This microcontroller offers unparalleled performance and reliability, making it ideal for a wide range of applications. Whether you're working on IoT devices, robotics, or industrial automation, this versatile microcontroller has you covered. Experience the value and benefits of cutting-edge technology with the LM3S5956-IQR80-C3 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good physical protection and insulation for the microcontroller, ensuring durability and reliability.

Surface Mount: YES

Surface mount design allows for easy integration onto PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy placement in compact designs.

Bit Size: 32

32-bit architecture provides high processing power, enabling complex computations and fast response times.

No. of Terminals: 64

64 terminals offer plenty of I/O options for connecting to external devices and peripherals.

Package Style (Meter): FLATPACK

Flatpack package style is easy to handle during production and offers good thermal performance for reliable operation.

Minimum Supply Voltage: 3 V

Low minimum supply voltage allows for energy-efficient operation and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables this microcontroller to function in cold temperatures without issues.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and reliable connections for stable performance.

ADC Channels: YES

Analog-to-digital converter channels allow for interfacing with analog sensors and signals, expanding the microcontroller's capabilities.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce CPU workload, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and facilitates efficient routing of signals.

Maximum Seated Height: 1.6 mm

Low seated height fits well in slim designs, contributing to space-saving and sleek products.

Width: 10 mm

Compact 10mm width makes this microcontroller suitable for applications where space is limited.

Maximum Clock Frequency: 16 MHz

High clock frequency of 16 MHz enables fast processing speeds and responsive operation.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering and reliability in manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C allows for robust solder joints and durable connections.

Length: 10 mm

Short 10mm length helps in creating compact and space-efficient designs with this microcontroller.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in demanding environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals into a single chip, reducing component count and simplifying design.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and inspection during production, ensuring good quality connections.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V provides consistent power for the microcontroller's operation.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of output signals, making this microcontroller suitable for applications requiring accurate timing.

ROM Programmability: FLASH

Flash programmable ROM provides flexibility for firmware updates and customization, enhancing the microcontroller's versatility.

Terminal Pitch: 0.5 mm

Fine 0.5mm terminal pitch enables high-density packaging and PCB layout, ideal for compact and miniaturized designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 ensures proper handling and storage requirements to maintain the microcontroller's reliability during manufacturing and assembly.

Speed: 80 rpm

Operating at 80 rpm speed, this microcontroller delivers fast and efficient performance for various control and computation tasks.

No. of I/O Lines: 33

With 33 I/O lines, this microcontroller offers ample connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S5956-IQR80-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5956-IQR80-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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