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LM3S300-IGZ25-C2

Texas Instruments

LM3S300-IGZ25-C2 by Texas Instruments

LM3S300-IGZ25-C2 by Texas Instruments is a 32-bit microcontroller with 36 I/O lines, 4096 bytes of RAM, and a max clock frequency of 25 MHz. Ideal for industrial applications requiring a compact design, it operates b/w -40 to 85°C and features Flash ROM programmability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,069 parts In-Stock

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8,069

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Digiode

USA . 2,618 parts In-Stock

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One Stop Electronics

USA . 1,230 parts In-Stock

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$1.000

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$1.000

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AZTECH Wire

Italy . 373 parts In-Stock

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$17.579

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373

$17.579

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Parana Technologies

USA . 855 parts In-Stock

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$31.876

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$90.832

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855

$31.876

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$90.832

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ChromeModa Solutions

Germany . 6,920 parts In-Stock

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$35.816

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$29.369

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6,920

$35.816

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IDEA Electronic Components Group

UK . 189 parts In-Stock

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$35.816

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$34.025

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$32.234

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189

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$32.234

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Microchip USA

USA . 1,955 parts In-Stock

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Corphita

USA . 1,348 parts In-Stock

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DigiPath Technology Company

USA . 1,042 parts In-Stock

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$32.292

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Kepictronics

USA . 168 parts In-Stock

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Overview

Unlock the limitless possibilities of embedded systems with the LM3S300-IGZ25-C2 microcontroller by Texas Instruments. Renowned for its innovative technology and unmatched quality, this microcontroller is designed to meet the demands of industrial applications. With a 32-bit architecture and a maximum clock frequency of 25 MHz, this chip delivers high performance and reliability. Whether you're developing automation systems, robotics, or IoT devices, the LM3S300-IGZ25-C2 offers unparalleled value, efficiency, and flexibility. Experience seamless integration and superior functionality with this cutting-edge microcontroller from Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount package makes it easy to integrate into PCB designs and provides space-saving benefits.

Maximum Supply Voltage: 3.6 V

Allows for a broader range of input voltage compatibility, providing flexibility in power supply options.

Package Shape: SQUARE

Square packages are easier to handle and align during assembly, contributing to ease of manufacturing.

Bit Size: 32

32-bit architecture offers higher processing capabilities and performance compared to lower bit architectures.

Power Supplies (V): 3.3

Operates at a standard voltage level, allowing compatibility with various power sources and reducing the need for additional voltage regulation.

No. of Terminals: 48

Offers a sufficient number of terminals for connecting external components and peripherals, enabling versatile applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of package styles provides options for different thermal management solutions and space requirements in a design.

Minimum Supply Voltage: 3 V

Ensures reliable operation even at lower voltage levels, improving efficiency and power consumption.

Maximum Operating Temperature: 85 °C

Operates within a wide temperature range, suitable for industrial applications with varying environmental conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments, making it suitable for a wide range of applications.

ADC Channels: YES

Integrated Analog-to-Digital Converter channels allow for analog sensor interfacing, enabling data acquisition and processing.

Terminal Position: QUAD

Quad terminal positioning enhances connectivity options and facilitates routing and layout considerations on the PCB.

ROM Words: 16384

Generous ROM capacity for program storage, supporting complex firmware and software requirements.

Maximum Seated Height: 1 mm

Low-profile design is advantageous for space-constrained applications and enhances overall system compactness.

Width: 6.875 mm

Narrow width allows for efficient placement on the PCB, optimizing board space and layout considerations.

Maximum Clock Frequency: 25 MHz

High clock frequency supports rapid data processing and execution speeds, enhancing overall system performance.

Length: 6.875 mm

Compact length accommodates constraints in PCB layouts and designs, ensuring efficient use of available space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions typical in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient processing, reduced power consumption, and quicker execution of instructions.

RAM Bytes: 4096

Adequate RAM capacity for data storage and processing, enabling multitasking and efficient operation of complex algorithms.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: NO LEAD

Leadless terminals offer space-saving benefits, improved reliability, and ease of manufacturing during PCB assembly.

Maximum Supply Current: 65 mA

Moderate supply current requirement contributes to energy efficiency and minimizes power consumption in operation.

Nominal Supply Voltage: 3.3 V

Stable and commonly used nominal supply voltage enables compatibility with standard power sources and peripherals.

PWM Channels: YES

Integrated Pulse-Width Modulation channels facilitate precise control of analog outputs, suitable for motor control and signal modulation.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and modifications, essential for evolving system requirements and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density PCB designs, enhancing connectivity options in space-constrained applications.

Speed: 25 rpm

Operates at a moderate speed suitable for various control and processing tasks, offering a balance between performance and efficiency.

No. of I/O Lines: 36

Ample I/O lines support versatile interfacing with external devices and peripherals, enhancing the product's connectivity and functionality.

Technical Specifications

Microcontrollers LM3S300-IGZ25-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S300-IGZ25-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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