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LM3S2911-IBZ50-A2T

Texas Instruments

LM3S2911-IBZ50-A2T by Texas Instruments

LM3S2911-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 8.192 MHz, suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a package style of grid array and terminal finish of tin silver copper, it offers versatile connectivity options for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,341 parts In-Stock

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Digiode

USA . 2,826 parts In-Stock

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2,826

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Distributors (Availability)

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AZTECH Wire

Italy . 294 parts In-Stock

1+ parts

$5.320

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294

$5.320

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One Stop Electronics

USA . 1,413 parts In-Stock

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$21.000

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$21.000

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Parana Technologies

USA . 934 parts In-Stock

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$36.456

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934

$36.456

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Microchip USA

USA . 3,767 parts In-Stock

1+ parts

$37.110

100+ parts

$36.580

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$36.320

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$36.050

3,767

$37.110

$36.580

$36.320

$36.050

DigiPath Technology Company

USA . 1,034 parts In-Stock

1+ parts

$40.143

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1,034

$40.143

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ChromeModa Solutions

Germany . 2,256 parts In-Stock

1+ parts

$40.962

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$33.589

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2,256

$40.962

$33.589

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IDEA Electronic Components Group

UK . 794 parts In-Stock

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$40.962

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$38.914

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$36.866

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794

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QUARKTWIN TECHNOLOGY LTD

USA . 6,421 parts In-Stock

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Corphita

USA . 1,999 parts In-Stock

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Overview

Discover the power of Texas Instruments with the LM3S2911-IBZ50-A2T microcontroller. This top-of-the-line product offers unparalleled quality and reliability, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers superior performance and efficiency. With advanced features and cutting-edge technology, customers can trust in the value and benefits that this product provides. Experience the advantages of Texas Instruments and take your projects to the next level with the LM3S2911-IBZ50-A2T.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount : YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage : 2.75 V

Suitable for low power applications, helping to conserve energy.

Package Shape : SQUARE

Optimal design for efficient use of space on the circuit board.

Bit Size : 32

Offers high processing capability and performance for various applications.

Power Supplies (V) : 2.5,3.3

Compatibility with common power sources, making it versatile for different projects.

No. of Terminals : 108

Provides ample connectivity options for interfacing with external components.

Package Style (Meter) : GRID ARRAY

Enhances thermal conductivity and electrical performance of the microcontroller.

Minimum Supply Voltage : 2.25 V

Allows for operation in low voltage conditions without compromising performance.

Maximum Operating Temperature : 85 °C

Suitable for industrial environments with high temperature requirements.

Minimum Operating Temperature : -40 °C

Can withstand cold temperatures, making it suitable for a variety of conditions.

Terminal Finish : TIN SILVER COPPER

Ensures reliable connections and prevents corrosion on the terminals.

ADC Channels : YES

Enables analog to digital conversion for sensor interfacing and measurement applications.

Terminal Position : BOTTOM

Facilitates easy PCB layout and soldering during assembly.

ROM Words : 262144

Offers ample memory for storing program instructions and data.

Maximum Seated Height : 1.5 mm

Low profile design for space-constrained applications.

Width : 10 mm

Compact size for integration into small electronic devices or systems.

Maximum Clock Frequency : 8.192 MHz

High clock speed for fast processing and execution of instructions.

Maximum Time At Peak Reflow Temperature (s) : 30

Ensures reliable soldering during assembly process.

Peak Reflow Temperature °C : 260

Can withstand high temperature soldering processes without damage.

Length : 10 mm

Symmetrical dimensions for balanced layout on the circuit board.

Temperature Grade : INDUSTRIAL

Designed to operate reliably in industrial temperature environments.

Peripheral IC Type : MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient processing and reduced power consumption.

RAM Bytes : 65536

Sufficient memory for data storage and manipulation during program execution.

Technology : CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form : BALL

Ball grid array terminals for reliable connections and easy soldering.

Nominal Supply Voltage : 2.5 V

Optimal voltage level for stable and efficient operation of the microcontroller.

PWM Channels : YES

Supports Pulse Width Modulation for precise control of output signals.

ROM Programmability : FLASH

Allows for reprogramming of memory contents, enabling flexibility for software updates.

Terminal Pitch : 0.8 mm

Fine pitch terminals for high density mounting on the PCB.

Moisture Sensitivity Level (MSL) : 3

Suitable for reflow soldering processes with moderate exposure to moisture.

Speed : 50 rpm

Indicates the maximum speed capability for real-time processing tasks.

No. of I/O Lines : 60

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S2911-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2911-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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