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LM3S2601-IQC50-A2T

Texas Instruments

LM3S2601-IQC50-A2T by Texas Instruments

Texas Instruments' LM3S2601-IQC50-A2T is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 50 MHz, it features 60 I/O lines and PWM channels for industrial applications. With a temperature range of -40 to 85°C, this CMOS technology device is ideal for various embedded systems requiring high-speed processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,613 parts In-Stock

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3,613

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Digiode

USA . 1,770 parts In-Stock

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1,770

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 726 parts In-Stock

1+ parts

$13.000

100+ parts

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726

$13.000

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AZTECH Wire

Italy . 682 parts In-Stock

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$16.420

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682

$16.420

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Microchip USA

USA . 2,305 parts In-Stock

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$39.140

100+ parts

$38.580

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$38.300

10k+ parts

$38.020

2,305

$39.140

$38.580

$38.300

$38.020

Parana Technologies

USA . 673 parts In-Stock

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$68.668

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673

$68.668

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IDEA Electronic Components Group

UK . 1,328 parts In-Stock

1+ parts

$77.155

100+ parts

$73.297

1k+ parts

$69.440

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1,328

$77.155

$73.297

$69.440

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ChromeModa Solutions

Germany . 232 parts In-Stock

1+ parts

$77.155

100+ parts

$63.267

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232

$77.155

$63.267

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Corphita

USA . 4,624 parts In-Stock

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DigiPath Technology Company

USA . 44 parts In-Stock

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$69.563

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44

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$69.563

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Overview

Elevate your projects to new heights with the LM3S2601-IQC50-A2T microcontroller by Texas Instruments. Known for their superior quality and cutting-edge technology, Texas Instruments delivers unbeatable performance in the world of microcontrollers. Whether you're working on robotics, industrial automation, or IoT applications, this 32-bit powerhouse offers unmatched value, efficiency, and reliability. Say goodbye to limitations and hello to endless possibilities with the LM3S2601-IQC50-A2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers good durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto a circuit board, saving time and space.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe operation of the microcontroller, preventing damage from overvoltage.

Package Shape: SQUARE

The square package shape is compact and space-efficient, making it suitable for applications where space is limited.

Bit Size: 32

The 32-bit architecture of the microcontroller allows for efficient data processing and handling of complex tasks.

Power Supplies (V): 2.5,3.3

The availability of multiple power supply options (2.5V and 3.3V) allows for flexibility in designing the power system for the microcontroller.

No. of Terminals: 100

With 100 terminals, the microcontroller can interface with a wide range of external components and peripherals, enhancing its functionality.

Package Style (Meter): FLATPACK

The flatpack package style offers easy handling and installation of the microcontroller on the circuit board, simplifying the assembly process.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25 V ensures reliable operation of the microcontroller, even under low voltage conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for the microcontroller to be used in industrial applications where temperature may vary.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance of the microcontroller even in extreme cold conditions.

Terminal Finish: TIN

The TIN terminal finish provides good electrical conductivity and corrosion resistance, ensuring reliable connections for the microcontroller.

Terminal Position: QUAD

The quad terminal position allows for easy and secure mounting of the microcontroller on the circuit board, enhancing its stability and reliability.

ROM Words: 131072

With 131072 ROM words, the microcontroller has ample memory capacity to store program instructions and data, enabling efficient operation.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm allows for slim and compact designs using the microcontroller, ideal for space-constrained applications.

Width: 14 mm

The 14 mm width of the microcontroller makes it suitable for applications where space is limited, providing flexibility in design.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency of 50 MHz enables fast and efficient processing of instructions, making the microcontroller suitable for high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures reliable soldering of the microcontroller during assembly, preventing damage from overheating.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering of the microcontroller onto the circuit board, creating strong and reliable connections.

Length: 14 mm

The 14 mm length of the microcontroller contributes to its compact and space-efficient design, making it suitable for small form factor applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance of the microcontroller in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripheral ICs, this product offers efficient and optimized processing capabilities for a wide range of applications.

RAM Bytes: 32768

With 32768 RAM bytes, the microcontroller has sufficient memory to handle data processing and temporary storage requirements efficiently.

Technology: CMOS

The CMOS technology used in the microcontroller offers low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Terminal Form: GULL WING

The gull wing terminal form provides easy installation and secure connections for the microcontroller, ensuring reliable operation in various applications.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V ensures stable and consistent power supply for the microcontroller, contributing to its reliable performance.

PWM Channels: YES

The presence of PWM channels allows for precise control of various applications such as motor speed control, LED brightness adjustment, and power management.

ROM Programmability: FLASH

The FLASH ROM programmability enables easy and quick updates of program codes and data, facilitating flexible and dynamic operation of the microcontroller.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density mounting of the microcontroller on the circuit board, saving space and enabling compact designs.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the microcontroller is suitable for surface mount assembly processes with multiple reflow cycles.

Speed: 50 rpm

The speed of 50 rotations per minute (rpm) refers to the maximum clock frequency of the microcontroller, enabling fast and efficient data processing.

No. of I/O Lines: 60

With 60 I/O lines, the microcontroller can interface with a wide range of external devices and peripherals, enhancing its versatility and connectivity.

Technical Specifications

Microcontrollers LM3S2601-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2601-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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